5SGXEA4K3F35C3G

The 5SGXEA4K3F35C3G is a Stratix V GX family Field Programmable Gate Array (FPGA) IC from Intel. It delivers a high-density, commercial‑grade programmable fabric with large on‑chip memory and substantial I/O capacity for designs that require significant logic integration and high‑speed interfacing.

Built for applications that demand abundant logic resources, extensive embedded memory, and numerous I/O, this device provides designers a platform for complex digital signal processing, prototyping, and high‑bandwidth data handling where a commercial temperature grade (0 °C to 85 °C) is acceptable.

Key Features

• Core Logic  Approximately 420,000 logic elements to implement large-scale custom digital designs and complex state machines.
• Embedded Memory  Approximately 38 Mbits of on‑chip RAM to support buffering, on‑device data storage, and local memory requirements.
• I/O Capacity  432 user I/O pins for broad connectivity to peripherals, memory interfaces, and board‑level signals.
• Transceiver Class (Stratix V GX)  Stratix V GX family devices include high‑speed transceiver speed grade options as documented for the family, supporting high‑bandwidth serial links (refer to the device series documentation for specific transceiver speed grades).
• Power and Core Voltage  Core supply range of 820 mV to 880 mV for the device core power domain.
• Package & Mounting  1152‑BBGA FCBGA package (supplier device package: 1152‑FBGA, 35×35); surface‑mount device suitable for modern PCB assembly processes.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, consistent with commercial system use.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• High‑density digital signal processing  Large logic capacity and substantial embedded RAM enable implementation of DSP pipelines, filters, and custom accelerators on a single device.
• High‑bandwidth communications and networking  Extensive I/O and Stratix V GX transceiver capabilities support high‑speed serial links and multi‑lane communications subsystems.
• Prototyping and system validation  Large programmable fabric and on‑chip memory make the device suitable for hardware prototyping, algorithm validation, and complex system emulation at commercial temperatures.

Unique Advantages

• High logic density: The device’s ~420,000 logic elements let designers consolidate complex functions into one FPGA, reducing board complexity.
• Significant embedded memory: Approximately 38 Mbits of on‑chip RAM supports data buffering and reduces dependence on external memory for many workloads.
• Large I/O complement: 432 I/O pins provide flexibility for interfacing multiple peripherals, parallel buses, and external devices without extensive multiplexing.
• Commercial temperature availability: Rated 0 °C to 85 °C for applications and deployments where commercial grade operation is appropriate.
• Industry‑standard package: 1152‑BBGA (35×35) surface‑mount package enables integration into contemporary PCB designs and manufacturing flows.
• Regulatory compliance: RoHS compliance supports environmental and regulatory requirements in standard commercial products.

Why Choose 5SGXEA4K3F35C3G?

The 5SGXEA4K3F35C3G combines a high logic element count, substantial embedded memory, and a large I/O count in a commercial‑grade Stratix V GX device package. It is well suited to engineers who need to consolidate complex digital functions, implement high‑throughput data paths, and prototype advanced algorithms within a single programmable device.

As a member of the Stratix V GX family, this FPGA offers designers a predictable platform for scaling logic, memory, and I/O resources within commercial temperature constraints, helping to shorten development cycles and enable dense system implementations.

Request a quote or submit a pricing inquiry to evaluate the 5SGXEA4K3F35C3G for your next design. Our team can provide availability and purchasing information tailored to your project timeline.