5SGXEA4K3F35C2L

The 5SGXEA4K3F35C2L is a Stratix® V GX family FPGA in a 1152-BBGA (35×35) FCBGA package designed for commercial-grade applications. It combines a large logic fabric, substantial embedded memory, and a high pin count I/O interface to support complex digital designs and system integration.

This device is suited for applications that require high gate density and flexible I/O, offering a combination of on-chip resources and a compact surface-mount package for board-level deployment.

Key Features

• Core Logic Approximately 420,000 logic elements and 158,500 CLBs provide extensive programmable logic capacity for complex designs.
• Embedded Memory Approximately 37.9 Mbits of embedded memory (total RAM bits: 37,888,000) to support buffering, on-chip data storage, and algorithm acceleration.
• I/O Capability 432 I/O pins enable broad external connectivity and flexible interface implementation.
• Power Core voltage supply range from 820 mV to 880 mV to match targeted power domains and system power rails.
• Package & Mounting 1152-BBGA (FCBGA) surface-mount package, supplier device package 1152-FBGA (35×35), optimized for dense board integration.
• Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance RoHS compliant for environmental and regulatory compatibility in commercial products.

Typical Applications

• High-density digital processing – Use the large logic element count and embedded memory for compute-heavy logic, custom accelerators, and protocol processing.
• Multi-channel I/O systems – 432 I/Os enable complex board-level interfacing, front-end aggregation, and signal routing for communication and data acquisition systems.
• Prototyping and system integration – The surface-mount 1152-FBGA package and commercial temperature rating make it suitable for board-level prototypes and production systems in commercial environments.

Unique Advantages

• Large programmable fabric: High logic element and CLB counts allow consolidation of multiple functions into a single FPGA, reducing system component count.
• Substantial on-chip memory: Nearly 38 Mbits of embedded RAM supports substantial buffering and on-chip data manipulation without immediate external memory dependencies.
• High I/O density: 432 I/Os provide flexibility for multi-protocol interfaces and dense external connectivity.
• Compact, board-ready package: 1152-BBGA (35×35) FCBGA package enables dense PCB layouts while maintaining a large resource set.
• Commercial-grade deployment: Rated for 0 °C to 85 °C, this device is aligned with commercial application requirements and RoHS compliance.
• Controlled core voltage range: Narrow supply window (820 mV–880 mV) simplifies power-supply planning for the core domain.

Why Choose 5SGXEA4K3F35C2L?

The 5SGXEA4K3F35C2L delivers a combination of high logic density, significant embedded memory, and extensive I/O in a compact 1152-FBGA package—well suited for commercial designs requiring on-chip capacity and flexible interfacing. Its specifications make it appropriate for engineers consolidating multiple digital functions onto a single FPGA and for systems where board-level space efficiency and resource integration are priorities.

For design teams targeting commercial products, this Stratix® V GX device provides verifiable on-chip resources, a defined operating temperature range, and RoHS compliance, supporting manufacturable and scalable deployments.

Request a quote or submit an inquiry to get pricing and availability for 5SGXEA4K3F35C2L and to discuss how it fits your next design.