5SGXEA4K3F35C4G

The 5SGXEA4K3F35C4G is a Stratix® V GX field programmable gate array (FPGA) in a 1152-BBGA (FCBGA) surface-mount package. It combines a large programmable fabric, substantial on-chip RAM, and a high I/O count to address high-density digital logic implementations.

Designed for commercial applications, this device provides a balance of logic capacity, embedded memory, and package density for complex system designs that require significant integration on a single FPGA.

Key Features

• High Logic Capacity  420,000 logic elements for implementing large-scale, custom digital designs.
• Embedded Memory  Approximately 37.9 Mbits (37,888,000 bits) of on-chip RAM to support buffers, FIFOs, and memory-intensive functions.
• Generous I/O Count  432 I/O pins to support multiple board-level interfaces and high-pin-count peripherals.
• Low-Voltage Core Supply  Core supply range of 820 mV to 880 mV for designs targeting low core voltage operation.
• High-Density Package & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) in a surface-mount format for compact PCB integration.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial-environment deployments.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• High-density logic implementations  Use the large logic fabric to consolidate multiple functions or complex state machines onto a single device.
• Memory-intensive subsystems  Leverage approximately 37.9 Mbits of on-chip RAM for buffering, frame storage, or intermediate data staging to reduce external memory needs.
• Multi-interface designs  432 I/Os enable systems that require many external signals, peripheral interfaces, or parallel data paths.
• Prototyping and system integration  High logic and I/O density make this device suitable for integrating and validating complex SoC or accelerator concepts in a commercial-temperature environment.

Unique Advantages

• Large programmable fabric: 420,000 logic elements allow implementation of extensive custom logic without partitioning across multiple FPGAs.
• Significant on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory components and simplifies board design.
• High I/O density: 432 I/Os simplify interfacing to multiple subsystems and reduce the need for external multiplexing.
• Compact, industry-standard package: 1152-FBGA (35×35) surface-mount package enables high-density PCB layouts while maintaining manufacturability.
• Low-voltage core operation: 820–880 mV supply range supports designs optimized for lower core voltages.
• Compliance-ready: RoHS compliance supports environmental and regulatory requirements for commercial products.

Why Choose 5SGXEA4K3F35C4G?

5SGXEA4K3F35C4G is positioned for designers who need a high-capacity, commercial-grade Stratix® V GX FPGA with substantial embedded memory and a high I/O count in a compact FCBGA package. Its combination of 420,000 logic elements and approximately 37.9 Mbits of on-chip RAM makes it well suited to consolidate complex logic, buffering, and interfacing tasks within a single device.

For teams focused on reducing BOM complexity and integrating dense functionality on a single board, this device delivers a verified commercial-temperature option with RoHS compliance and a surface-mount 1152-FBGA package for compact system design.

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