5SGXEA4K3F35I3L

The 5SGXEA4K3F35I3L is an Intel Stratix® V GX field-programmable gate array (FPGA) supplied in a 1152-ball FBGA package. It delivers very high logic capacity, substantial on-chip memory, and a large I/O count targeted at industrial-grade digital designs.

Key device characteristics include 420,000 logic elements, approximately 38 Mbits of embedded RAM, 432 user I/Os, an industrial operating temperature range of –40 °C to 100 °C, and a core supply voltage range of 820 mV to 880 mV—making it suitable for dense, memory- and I/O‑intensive FPGA implementations.

Key Features

• Core logic capacity  420,000 logic elements for implementing large-scale custom logic, datapaths, and acceleration functions.
• Embedded memory  Approximately 38 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory for many workloads.
• I/O density  432 user I/Os to support high-pin-count interfacing, broad peripheral integration, and complex board-level routing.
• Industrial temperature grade  Rated for operation from –40 °C to 100 °C, enabling deployment in industrial and other temperature-challenging environments.
• Core voltage  Low-voltage core supply range of 820 mV to 880 mV for designs that target optimized power domains.
• Package and mounting  1152-BBGA / FCBGA (supplier package: 1152-FBGA, 35×35 mm) in a surface-mount form factor for compact board implementation.
• Regulatory status  RoHS compliant.

Typical Applications

• High-density logic implementations  Large-scale algorithm acceleration and custom digital logic that require hundreds of thousands of logic elements.
• Memory-intensive designs  Applications that need significant on-chip buffering and local memory use the approximately 38 Mbits of embedded RAM.
• I/O-rich systems  Complex system integration and multi-interface boards that require hundreds of user I/Os for sensors, peripherals, or board-level interconnect.
• Industrial electronics  Systems operating across wide temperature ranges benefit from the device’s industrial-grade –40 °C to 100 °C rating.

Unique Advantages

• High logic density: Enables consolidation of complex logic and multiple functions into a single FPGA, reducing BOM and board area.
• Substantial on-chip memory: Large embedded RAM capacity supports deep buffering and high-throughput datapaths without immediate external memory dependence.
• Extensive I/O count: 432 I/Os simplify integration with multiple peripherals, mezzanine cards, or expansion interfaces.
• Industrial temperature operation: Rated –40 °C to 100 °C for reliable operation in demanding environmental conditions.
• Compact FBGA package: 1152-ball FCBGA (35×35 mm) provides a high-pin-count solution in a compact surface-mount footprint.
• Low-voltage core: 820 mV–880 mV core supply range supports power-domain optimization on advanced boards.

Why Choose 5SGXEA4K3F35I3L?

5SGXEA4K3F35I3L positions itself for designs that require very high logic capacity, large embedded memory, and significant I/O routing within an industrial temperature envelope. As a Stratix V GX family device from Intel/Altera, it aligns with a series of FPGAs documented for high‑density and transceiver-enabled applications while offering device-level specifications suitable for demanding embedded systems.

Choose this device when your design priorities are dense programmable logic, plentiful on-chip RAM, and robust temperature operation—delivering scalability and integration for complex digital systems.

Request a quote or submit your requirements today to receive pricing and availability for the 5SGXEA4K3F35I3L.