5SGXEA4K3F35I3LN

The 5SGXEA4K3F35I3LN is a Stratix® V GX field programmable gate array (FPGA) IC in a 1152-BBGA (35 × 35) FCBGA package. As part of the Stratix V GX family, this industrial-grade device delivers large logic capacity, extensive I/O, and substantial on-chip RAM for demanding embedded and industrial applications.

Designed for systems that require significant programmable logic and memory within an industrial operating temperature range, the device combines high resource counts with a compact surface-mount package and RoHS compliance.

Key Features

• Logic Capacity — 420,000 logic elements (logic cells) to implement complex custom logic, datapaths, and RTL designs.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM for buffering, LUT-based storage, and memory-intensive functions.
• I/O Density — 432 I/O pins to support wide parallel interfaces, high-pin-count peripherals, and board-level connectivity.
• Package & Mounting — 1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for PCB-level integration.
• Power — Core voltage supply range of 820 mV to 880 mV for system power planning and regulator selection.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
• Standards & Compliance — RoHS-compliant for lead-free manufacturing processes.
• Family Characteristics — As a Stratix V GX device, it is part of a family that documents transceiver specifications, core and periphery performance, and I/O timing in the Stratix V device datasheet.

Typical Applications

• Industrial Control & Automation — The industrial temperature grade (−40 °C to 100 °C) and large logic/memory resources support control, sequencing, and real-time processing tasks in industrial equipment.
• High‑Density I/O Systems — 432 I/Os enable connectivity to multi-channel sensor arrays, wide parallel busses, or high-pin-count peripheral interfaces.
• Memory-Intensive Embedded Processing — Approximately 37.9 Mbits of on-chip RAM provides capacity for buffering, packet processing, and embedded data structures.
• Custom Hardware Acceleration & Prototyping — Large logic element count supports complex RTL implementations and hardware-accelerated algorithms.

Unique Advantages

• High Logic Density: 420,000 logic elements let you consolidate multiple functions into a single FPGA, reducing board-level BOM and interconnect complexity.
• Substantial Embedded Memory: Approximately 37.9 Mbits of RAM supports large buffers and on-chip data storage, minimizing external memory dependence.
• Robust I/O Capability: 432 I/Os provide flexibility for interfacing a wide variety of peripherals and parallel data streams without external multiplexing.
• Industrial Temperature Range: Specified −40 °C to 100 °C operation enables deployment in harsh or temperature-variable environments.
• Compact, Surface-Mount Package: 1152-BBGA (35×35) FCBGA provides a high-pin-count solution in a single, manufacturable surface-mount package.
• Regulatory Ease: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 5SGXEA4K3F35I3LN?

The 5SGXEA4K3F35I3LN positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suitable for designs that demand extensive programmable logic, significant on-chip RAM, and large I/O counts in a compact surface-mount package. Its combination of 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 432 I/Os provides the resources needed to integrate complex functions and reduce external component count.

For engineering teams targeting industrial systems, high-density I/O platforms, or custom acceleration and prototyping projects, this device offers a balance of integration, thermal range, and package density that supports scalable designs and long-term deployment.

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