5SGXEA4K3F40C2G

The 5SGXEA4K3F40C2G is a Stratix V GX family FPGA from Intel, offering high logic density and substantial on‑chip memory for complex programmable logic designs. This commercial‑grade, surface‑mount FPGA is targeted at applications that require a large number of logic elements, extensive I/O, and significant embedded RAM capacity.

Key value propositions include a high count of logic elements, approximately 38 Mbits of embedded memory, and a dense 1517‑FBGA (40×40) package that supports designs needing compact, high‑capacity programmable logic.

Key Features

• Logic Capacity  Provides 420,000 logic elements and 158,500 logic blocks for implementing large-scale digital designs and complex state machines.
• Embedded Memory  Approximately 38 Mbits of on‑chip RAM to support buffering, lookup tables, and memory‑intensive functions without relying solely on external memory.
• I/O Density  Up to 696 I/O pins to accommodate high channel counts and dense external interfacing requirements.
• Power Supply  Core voltage supply range of 870 mV to 930 mV to match modern low‑voltage FPGA power architectures.
• Package & Mounting  1517‑BBGA (FCBGA) supplier device package 1517‑FBGA (40×40); surface‑mount for PCB integration in space‑constrained designs.
• Commercial Grade Temperature  Rated for operation from 0 °C to 85 °C to meet commercial application temperature requirements.
• RoHS Compliant  Manufactured to meet RoHS requirements for regulated materials.

Typical Applications

• High‑density logic systems  Implement complex combinational and sequential logic, large state machines, and programmable datapaths using the FPGA’s 420,000 logic elements.
• Memory‑intensive processing  Use the approximately 38 Mbits of embedded RAM for buffering, LUTs, and intermediate storage to reduce external memory dependence.
• Multichannel I/O and interface aggregation  Support systems that require many external connections—up to 696 I/O—for dense sensor arrays, multiport interfaces, or aggregation of peripheral signals.
• Compact, high‑capacity board designs  Deploy the 1517‑FBGA (40×40) package in space‑constrained PCBs where high logic density and numerous I/Os are required.

Unique Advantages

• Large logic resource pool: 420,000 logic elements enable implementation of substantial digital functions without partitioning across multiple devices.
• Significant on‑chip memory: Approximately 38 Mbits of embedded RAM reduces the need for external memory and simplifies board-level BOM.
• High I/O count: 696 I/Os provide flexibility for high‑channel designs, multiple interfaces, and parallel data paths.
• Compact FCBGA packaging: 1517‑FBGA (40×40) package delivers high I/O and silicon density in a compact footprint suitable for modern system boards.
• Commercial operating range: Rated 0 °C to 85 °C for reliable operation in commercial environments.
• RoHS compliance: Manufactured to meet environmental material standards for regulated substances.

Why Choose 5SGXEA4K3F40C2G?

The 5SGXEA4K3F40C2G Stratix V GX FPGA combines a very high count of logic elements, substantial embedded memory, and a large I/O complement in a compact FCBGA package, making it well suited for designers who need to integrate dense programmable logic and memory on a single device. Its commercial temperature rating and RoHS compliance make it appropriate for a wide range of commercial electronic systems.

Backed by Stratix V family documentation and Intel manufacturing, this device is a practical option for development teams requiring scalable logic resources, significant on‑chip RAM, and extensive external interfacing while maintaining a compact board footprint.

Request a quote or submit a procurement inquiry to receive pricing, availability, and technical support options for the 5SGXEA4K3F40C2G Stratix V GX FPGA.