5SGXEA4K3F40C2N

The 5SGXEA4K3F40C2N is a Stratix® V GX field programmable gate array (FPGA) in a 1517-BBGA FCBGA package designed for high-density, high-performance digital designs. It integrates approximately 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and up to 696 user I/O pins to support complex system integration on a single device.

Built for commercial-grade applications, this surface-mount FPGA operates from a core voltage range of 870 mV to 930 mV and is specified for an ambient operating temperature range of 0°C to 85°C. As a member of the Stratix V GX family, the device is covered by the family datasheet electrical and transceiver specifications.

Key Features

• Core Capacity — Approximately 420,000 logic elements to support large-scale logic implementations and complex algorithm mapping.
• On‑Chip Memory — Approximately 37.9 Mbits of embedded RAM for buffering, FIFOs, and memory-intensive functions.
• High Pin Count I/O — Up to 696 I/O pins for extensive peripheral and board-level connectivity.
• Transceiver Family Characteristics — As a Stratix V GX device, the family datasheet defines transceiver speed grades (for example, GX channel options up to 14.1 Gbps) useful when designing high-speed serial links.
• Power and Voltage — Core supply voltage specified between 870 mV and 930 mV for reliable power planning.
• Package & Mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), optimized for surface-mount assembly.
• Commercial Temperature Grade — Rated for 0°C to 85°C ambient operation for commercial applications.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High‑density logic systems — Large FPGA logic capacity and embedded memory make the device suitable for consolidation of multi-function digital processing into a single chip.
• Memory‑intensive data buffering — Approximately 37.9 Mbits of on-chip RAM supports deep buffering, FIFOs, and packet handling.
• High‑I/O interfacing — Up to 696 I/Os enable extensive sensor, peripheral, and board-level interfacing without multiple companion devices.
• High‑speed serial links — Stratix V GX family transceiver specifications (as documented in the family datasheet) support designs that require high-speed serial channels.

Unique Advantages

• Large logic fabric: Approximately 420,000 logic elements reduce the need for multiple devices when implementing complex designs.
• Substantial embedded memory: Approximately 37.9 Mbits of RAM enables on-chip data storage and real-time buffering to simplify system architecture.
• Extensive I/O availability: 696 I/Os provide flexibility for diverse board-level connections and high-density interfaces.
• Compact FCBGA package: 1517-BBGA (1517-FBGA, 40×40) delivers high pin density in a surface-mount form factor suitable for space-constrained PCBs.
• Commercial temperature rating: Specified 0°C to 85°C operation aligns with a wide range of commercial electronic applications.
• Standards‑aware design baseline: RoHS compliance supports environmentally conscious manufacturing and sourcing.

Why Choose 5SGXEA4K3F40C2N?

The 5SGXEA4K3F40C2N offers a balanced combination of large logic capacity, significant embedded memory, and high I/O density in a single commercial-grade Stratix V GX FPGA package. Its core voltage window and package choices provide predictable integration into power and mechanical designs, while the family datasheet provides detailed electrical and transceiver guidance for high-speed serial applications.

This device is well suited to engineers and system designers who need to consolidate complex digital functions, implement memory-heavy processing, and support extensive peripheral connectivity with a single, high-capacity FPGA platform.

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