5SGXEA4K3F40C2WN

The 5SGXEA4K3F40C2WN is an Intel Stratix V GX field-programmable gate array offered in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. This commercial-grade device provides large on-chip logic and memory resources along with a high I/O count for demanding programmable logic designs.

With 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 696 user I/O, this Stratix V GX device addresses high-density logic, complex data-paths, and I/O-intensive applications while operating from a 870 mV–930 mV core supply over a commercial temperature range of 0 °C to 85 °C.

Key Features

• Stratix V GX architecture Built on the Stratix V GX device family with documented electrical and switching characteristics suitable for high-density programmable logic implementations.
• Logic capacity 420,000 logic elements to implement large combinational and sequential logic functions.
• Embedded memory Approximately 37.9 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• High I/O count 696 available I/O pins to support wide parallel interfaces and dense connectivity.
• Package and mounting 1517-BBGA (1517-FBGA, 40×40) FCBGA package in a surface-mount form factor for compact board designs.
• Power and temperature Core voltage supply of 870 mV to 930 mV and commercial operating temperature range of 0 °C to 85 °C.
• Standards compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-bandwidth communications Leverage the Stratix V GX device family capabilities and high I/O count for networking and data transport interfaces.
• Data processing and acceleration Large logic and memory resources enable implementation of custom datapaths, packet processing, and hardware acceleration functions.
• High-density I/O systems Use the 696 I/O pins and dense FBGA package in applications requiring broad peripheral and bus connectivity.

Unique Advantages

• High logic integration: 420,000 logic elements reduce the need for multiple devices by consolidating complex logic into a single FPGA.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM supports deep buffering and local storage for high-throughput designs.
• Dense I/O connectivity: 696 I/O pins enable wide parallel interfaces and simplify board-level routing for I/O-heavy systems.
• Commercial availability: Designed for commercial temperature operation (0 °C to 85 °C) to serve mainstream electronic products and prototypes.
• Compact package: 1517-FBGA (40×40) footprint offers a compact solution for high-capacity FPGA integration on space-constrained boards.
• RoHS compliant: Meets common environmental restrictions for manufacturing and deployment.

Why Choose 5SGXEA4K3F40C2WN?

The 5SGXEA4K3F40C2WN combines large logic capacity, significant embedded memory, and a high I/O count in a compact surface-mount FBGA package, making it well suited for designs that demand dense programmable logic and broad connectivity. Its commercial-grade operating range and documented electrical and switching characteristics provide a clear specification set for system integration and performance planning.

This device is appropriate for engineering teams developing high-density, I/O-intensive systems that require a single, highly integrated FPGA solution with well-defined power and thermal parameters. The Stratix V GX family documentation further supports detailed evaluation of electrical behavior, I/O timing, and transceiver characteristics where applicable.

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