5SGXEA4K3F40C2LN

The 5SGXEA4K3F40C2LN is an Intel Stratix V GX field programmable gate array (FPGA) optimized for high-density logic and I/O-centric designs. It combines substantial on-chip memory, a large logic element count, and a broad I/O complement to address complex processing and interfacing tasks.

Packaged in a 1517-BBGA FCBGA surface-mount format and offered as a commercial-grade device, this FPGA is suitable for projects that require dense logic resources, extensive connectivity, and controlled core voltage operation.

Key Features

• Core Capacity  Approximately 420,000 logic elements for implementing large-scale programmable logic and custom accelerators.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, FIFOs, and data-intensive algorithms.
• I/O and Connectivity  696 I/O pins provide broad external interfacing for high-pin-count systems and multi-channel peripherals.
• Stratix V GX Family  Part of the Stratix V GX device family as described in the device datasheet, supporting the GX-class FPGA architecture.
• Power Domain  Core supply range 0.820 V to 0.880 V to match tightly controlled core-voltage system designs.
• Package and Mounting  1517-BBGA (FCBGA) surface-mount package; supplier device package listed as 1517-FBGA (40×40) for compact board integration.
• Commercial Temperature Grade  Rated for 0°C to 85°C operation for standard commercial deployments.
• RoHS Compliance  RoHS compliant.

Typical Applications

• High-performance networking and communications: Use the large logic capacity and high I/O count for packet processing, protocol bridging, and line-card functions.
• Data center acceleration: Implement custom compute kernels and hardware offloads that benefit from high logic density and substantial embedded memory.
• Signal processing and instrumentation: Leverage the on-chip RAM and logic resources for real-time DSP, test instrumentation, and data acquisition front ends.
• Video and broadcast processing: Deploy the device for multi-channel video processing pipelines where memory and I/O bandwidth are important.

Unique Advantages

• High logic density: Approximately 420,000 logic elements enable integration of complex functions on a single device, reducing board-level partitioning.
• Large embedded memory: About 37.9 Mbits of on-chip RAM supports deep buffering and data-path implementations without extensive external memory.
• Extensive I/O capability: 696 I/O pins allow flexible interfacing to multiple peripherals, buses, and parallel data channels.
• Compact, high-density package: 1517-BBGA FCBGA (1517-FBGA 40×40 supplier package) supports space-efficient PCB layouts for dense system designs.
• Controlled core-voltage operation: Operates within a narrow 0.820–0.880 V supply window for designs that require stable core power domains.
• Commercial deployment-ready: Rated for 0°C–85°C operation and RoHS compliant for standard commercial applications.

Why Choose 5SGXEA4K3F40C2LN?

This Stratix V GX device from Intel delivers a combination of high logic capacity, substantial embedded memory, and a large I/O complement in a compact FCBGA package. It is positioned for designs that require dense programmable logic, wide interfacing capability, and predictable power-domain requirements.

Engineers specifying 5SGXEA4K3F40C2LN can leverage its on-chip resources to consolidate functions, reduce board-level complexity, and target commercial-temperature applications where verified Stratix V GX family characteristics are desirable.

Request a quote or submit a procurement inquiry to evaluate 5SGXEA4K3F40C2LN for your next design.