5SGXEA4K3F40C2L

The 5SGXEA4K3F40C2L is an Intel Stratix V GX field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers a high density of programmable logic and embedded memory, coupled with a very large I/O complement for complex digital designs.

With 420,000 logic elements, approximately 37.9 Mbits of embedded RAM, and 696 I/Os, this commercial-grade device is targeted at designs that require substantial logic capacity, significant on-chip memory, and broad system connectivity while operating within a 0 °C to 85 °C range.

Key Features

• High Logic Capacity — 420,000 logic elements provide substantial programmable fabric for large, complex designs and extensive custom logic integration.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms without relying entirely on external memory.
• Extensive I/O — 696 user I/Os enable connectivity to dense system interfaces, parallel buses, and numerous peripherals.
• Package and Mounting — Supplied in a 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Designed for surface-mount PCB assembly.
• Power Supply Range — Core voltage specified between 820 mV and 880 mV to match system power-architecture requirements.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial applications.
• Standards Compliance — RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• High-density digital systems — Use the large logic resource set and embedded memory to implement complex state machines, data-paths, and custom accelerators.
• Networking and communications equipment — Leverage the high I/O count and on-chip RAM for packet processing, buffering, and interface bridging in networking appliances.
• Signal processing and compute — Deploy the abundant logic elements and embedded memory for DSP pipelines, filtering, and algorithm acceleration.
• Prototyping and advanced system integration — Ideal for engineering prototypes and systems that require integration of many functions into a single FPGA package.

Unique Advantages

• High logic density: 420,000 logic elements reduce the need for multiple devices by consolidating logic into a single FPGA.
• Substantial on‑chip RAM: Approximately 37.9 Mbits of embedded memory supports large buffers and data structures on-chip, lowering external memory dependency.
• Very large I/O count: 696 available I/Os provide flexibility to interface with many peripherals and complex multi-lane systems.
• Compact FCBGA packaging: 1517-BBGA/1517-FBGA (40×40) package enables dense board-level integration while supporting surface-mount assembly processes.
• Commercial operating range: Rated 0 °C to 85 °C to match standard commercial deployments and system thermal profiles.
• RoHS compliant: Meets environmental and manufacturing compliance expectations for modern electronics production.

Why Choose 5SGXEA4K3F40C2L?

The 5SGXEA4K3F40C2L combines a very large programmable fabric, significant embedded memory, and an expansive I/O complement in a single Stratix V GX FPGA package. Its electrical and package specifications make it suitable for engineers building high-density digital systems, advanced communications equipment, and compute- or memory-intensive applications that require consolidated logic and connectivity.

As a commercial-grade Intel Stratix V GX device supplied in a 1517-BBGA FCBGA package and compliant with RoHS, this FPGA delivers a balance of integration, performance-oriented resources, and manufacturability for medium- to large-scale electronic products.

Request a quote or submit a sourcing inquiry for part number 5SGXEA4K3F40C2L to obtain pricing, lead time, and availability for your next design.