5SGXEA4K2F40I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 37888000 420000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 458 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXEA4K2F40I2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXEA4K2F40I2G is an Intel Stratix V GX family FPGA supplied in a 1517-BBGA FCBGA package. It provides a dense programmable fabric with a large number of logic elements and on-chip memory for complex, compute- and I/O-intensive embedded designs targeted at industrial applications.
Designed for surface-mount implementation and rated for industrial temperature operation, this device supports high integration in space-constrained board designs while operating from a tightly specified core voltage range.
Key Features
- Core Logic 420,000 logic elements (cells) and 158,500 LABs provide a high-density programmable fabric for complex logic and custom processing pipelines.
- Embedded Memory Approximately 37.9 Mbits of on-chip RAM to support frame buffers, FIFOs, and large state-machine storage without external memory in some applications.
- I/O Capacity 696 general-purpose I/O pins to support wide parallel interfaces, multiple high-pin-count peripherals, and flexible board-level connectivity.
- Package & Mounting 1517-BBGA (1517-FBGA, 40×40) package for dense BGA routing; surface-mount mounting type suitable for automated assembly.
- Power Supply Core operating supply specified from 870 mV to 930 mV, enabling predictable power planning and regulator selection.
- Temperature & Grade Industrial grade with an operating temperature range of −40°C to 100°C for deployment in demanding environmental conditions.
- Compliance RoHS compliant, supporting regulatory requirements for restricted substances.
Typical Applications
- High-density Signal Processing Implement complex DSP pipelines, data aggregation, and custom processing blocks using the large logic and embedded memory resources.
- Telecommunications & Networking Support wide parallel and serial I/O configurations and large buffering for packet processing, aggregation, or interface bridging.
- Industrial Control Systems Integrate deterministic control logic, multi-channel I/O, and embedded state machines for automation and instrumentation within the industrial temperature range.
- Prototyping & Custom ASIC Emulation Use the dense logic fabric and abundant on-chip RAM to prototype complex SoC functions or to emulate custom silicon behavior prior to tape-out.
Unique Advantages
- Large Logic Capacity: 420,000 logic elements and 158,500 LABs enable consolidation of multiple functions into a single device, reducing board-level BOM.
- Substantial Embedded Memory: Approximately 37.9 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage tasks, simplifying board design.
- Broad I/O Count: 696 I/Os provide flexibility to connect numerous peripherals and wide parallel interfaces without external multiplexing logic.
- Industrial Operating Range: Rated from −40°C to 100°C and RoHS compliant for deployment in industrial environments with regulatory compliance.
- Dense BGA Packaging: 1517-BBGA (40×40) package enables high pin count in a compact footprint suited to automated surface-mount assembly.
- Controlled Core Voltage Window: Specified 870 mV to 930 mV core supply supports predictable power delivery and thermal planning for system designers.
Why Choose 5SGXEA4K2F40I2G?
The 5SGXEA4K2F40I2G balances very large logic and memory resources with high I/O density and industrial-grade operation, making it suitable for demanding embedded systems that require integration of multiple functions on a single FPGA. Its BGA packaging and surface-mount form factor ease integration into production PCBs while supporting automated assembly processes.
Engineers and procurement teams seeking a Stratix V GX family device for high-capacity logic, substantial on-chip RAM, and broad I/O counts will find this device appropriate for complex signal processing, control, and prototyping applications where industrial temperature operation and RoHS compliance are required.
Request a quote or submit a pricing and availability inquiry to start evaluating the 5SGXEA4K2F40I2G for your next design.

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