5SGXEA5K1F35C1G

The 5SGXEA5K1F35C1G is a Stratix V GX family FPGA offered in a 1152-BBGA (FCBGA) package. This commercial-grade, surface-mount device provides a high logic capacity and substantial on-chip memory for complex digital designs.

Key architectural characteristics include 490,000 logic elements and approximately 46 Mbits of embedded RAM, combined with 432 user I/Os and a low core supply voltage range of 870 mV to 930 mV—enabling dense, power-aware system integration for demanding applications.

Key Features

• Core logic density — 490,000 logic elements (cells) to implement large-scale digital logic and custom datapaths.
• Embedded memory — Approximately 46 Mbits of on‑chip RAM for high-bandwidth buffering, LUT storage, and state retention without external memory.
• I/O capacity — 432 available I/Os to support dense connectivity to peripherals, interfaces, and board-level routing.
• Package and mounting — 1152‑BBGA (Supplier device package: 1152‑FBGA, 35×35) in a surface-mount FCBGA footprint for compact board integration.
• Power supply — Core voltage range of 870 mV to 930 mV for compatibility with low-voltage system rails.
• Operating conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS‑compliant device suitable for environments requiring restricted-substance conformity.
• Stratix V GX family context — Part of the Stratix V GX series, which includes devices with high-performance transceiver speed grades as documented in the device datasheet.

Unique Advantages

• High integration density: Large logic element count and substantial embedded RAM reduce the need for external logic and memory, simplifying system BOM and board area.
• High I/O count for system connectivity: 432 I/Os enable broad peripheral interfacing and complex multi-channel designs without multiple bridge components.
• Compact FCBGA footprint: The 1152‑FBGA (35×35) package supports high-pin-count designs while minimizing PCB real estate.
• Low-voltage core operation: Narrow supply window (870–930 mV) supports low-power core domains and modern power-rail architectures.
• Commercial-grade temperature rating: Designed for 0 °C to 85 °C operation to meet standard commercial electronics use cases.
• Regulatory readiness: RoHS compliance helps satisfy environmental and supply-chain requirements for many electronics programs.

Why Choose 5SGXEA5K1F35C1G?

The 5SGXEA5K1F35C1G delivers a balance of very high logic and memory resources, substantial I/O capacity, and a compact FCBGA package—making it suitable for complex digital systems that require dense integration on commercial-temperature designs. Its low-voltage core and RoHS compliance support modern power architectures and regulatory requirements.

This device is well suited for engineering teams and procurement sourcing designs that demand large on-chip resources, extensive I/O, and a compact board footprint while operating within defined commercial temperature limits.

Request a quote or submit an inquiry for pricing and availability of the 5SGXEA5K1F35C1G to move your design forward.