5SGXEA5H3F35I3N

The 5SGXEA5H3F35I3N is a Stratix V GX family FPGA providing large-scale programmable logic, abundant embedded memory, and a high I/O count in a 1152-BBGA FCBGA package. Designed for industrial-grade applications, this device integrates approximately 490,000 logic elements and approximately 46.08 Mbits of embedded RAM to support complex digital designs.

With support for Stratix V GX family transceiver speed grades and an operating supply range of 820 mV to 880 mV, the device targets designs that require substantial logic capacity, dense I/O, and extended operating temperature range (–40 °C to 100 °C).

Key Features

• Logic Capacity — Approximately 490,000 logic elements and about 185,000 logic array blocks provide the resources needed for large, multi-functional FPGA designs.
• Embedded Memory — Approximately 46.08 Mbits of on-chip RAM for buffering, DSP support, and large state machines.
• I/O Density — 552 user I/O pins to support wide parallel interfaces and complex system interconnects.
• Transceiver Options (Series-Level) — Stratix V GX family transceiver speed grades include channel options up to 14.1 Gbps, enabling high-speed serial link capability at the family level.
• Power Supply — Core voltage supply rated from 820 mV to 880 mV for devices built on this power envelope.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C to meet demanding environmental requirements.
• Package & Mounting — 1152-BBGA (FCBGA) / supplier package 1152-FBGA (35 × 35 mm) in a surface-mount form factor for high-density board designs.
• Regulatory — RoHS-compliant to meet common environmental requirements.

Typical Applications

• High-density logic systems — Implement large-scale programmable logic functions using approximately 490,000 logic elements and ~46 Mbits of embedded memory.
• Complex I/O aggregation — Consolidate and route wide parallel interfaces and multiple peripherals using 552 available I/O pins.
• Industrial and harsh-environment designs — Use in systems that require industrial temperature operation from –40 °C to 100 °C.

Unique Advantages

• Substantial on-chip resources: Large logic element and embedded memory counts reduce the need for external logic and RAM, simplifying BOM and board-level routing.
• High I/O count: 552 I/O pins allow extensive peripheral connectivity and wide bus implementations without additional interface chips.
• Industrial temperature rating: –40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Compact, high-density package: 1152-BBGA FCBGA (35 × 35) surface-mount package enables high integration in space-constrained PCB layouts.
• RoHS compliant: Meets common environmental standards for electronic assemblies.

Why Choose 5SGXEA5H3F35I3N?

The 5SGXEA5H3F35I3N positions itself as a high-capacity Stratix V GX FPGA option for engineers who need significant programmable logic, substantial embedded memory, and broad I/O capability in an industrial-grade package. Its combination of approximately 490,000 logic elements, roughly 46 Mbits of on-chip RAM, and 552 I/Os makes it suitable for complex, integrated digital designs that demand both capacity and reliability.

Selecting this device provides a scalable hardware foundation for systems that require dense logic, plentiful local memory, and a robust thermal operating window—backed by the Stratix V family characteristics documented in the device datasheet.

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