5SGXEA5H3F35I3G

The 5SGXEA5H3F35I3G is a Stratix® V GX Field Programmable Gate Array (FPGA) supplied in a 1152‑ball BGA package. As a Stratix V GX device, it combines a large logic fabric with substantial embedded memory and high‑density I/O to address demanding digital integration needs.

Key built‑in resources include approximately 46.08 Mbits of embedded memory, 490,000 logic elements, and up to 552 I/O pins. The device is offered in an industrial temperature grade with a core voltage supply range of 820 mV to 880 mV, making it suitable for industrial operating environments that require extended temperature capability.

Key Features

• Logic Capacity  490,000 logic elements provide large-scale programmable logic for complex designs and parallel data processing.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM to support buffering, data storage, and high‑throughput processing within the FPGA fabric.
• I/O Density  Up to 552 I/O pins enable high-channel interfacing and board-level aggregation of signals.
• Transceiver Capabilities (Series)  Stratix V GX devices include GX transceiver speed grades documented up to 14.1 Gbps (series-level specification in the Stratix V datasheet).
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet harsh environment requirements.
• Power Supply  Core voltage supply range specified from 820 mV to 880 mV for consistent core power provisioning.
• Package & Mounting  1152‑BBGA (FCBGA) package; supplier package listed as 1152‑FBGA (35 × 35). Surface mount device for standard PCB assembly.
• RoHS Compliance  RoHS‑compliant component to support regulatory requirements for lead‑free assembly.

Typical Applications

• High‑density digital processing  Large logic capacity and substantial embedded RAM make this FPGA suitable for designs that require complex algorithm implementation and parallel processing.
• Multi‑channel I/O aggregation  Up to 552 I/Os allow the device to serve as a central hub for systems requiring many external interfaces or high channel counts.
• Industrial control and instrumentation  Industrial temperature grade (−40 °C to 100 °C) supports deployment in factory and instrumentation environments with wide temperature ranges.
• Memory‑intensive accelerators  Approximately 46.08 Mbits of on‑chip RAM supports buffering and local data storage for accelerator and real‑time processing functions.

Unique Advantages

• High integration density: 490,000 logic elements and large on‑chip RAM reduce external component count and simplify system architecture.
• Extensive I/O capability: Up to 552 I/Os enable direct connection to numerous peripherals and high‑channel front ends without extensive external multiplexing.
• Industrial temperature operation: Rated for −40 °C to 100 °C to support robust performance across a wide range of operating conditions.
• Series transceiver performance: Stratix V GX series transceivers are documented at speed grades up to 14.1 Gbps, providing high‑speed serial interface options at the series level.
• Standard surface‑mount packaging: 1152‑BBGA FCBGA package (35 × 35) supports conventional PCB assembly and high‑density board layouts.
• Regulatory readiness: RoHS compliance facilitates lead‑free manufacturing and regulatory conformity.

Why Choose 5SGXEA5H3F35I3G?

The 5SGXEA5H3F35I3G Stratix V GX FPGA positions itself as a high‑capacity, industrial‑grade programmable device for engineers who need substantial logic resources, large embedded memory, and dense I/O in a single component. Its combination of 490,000 logic elements, approximately 46.08 Mbits of on‑chip RAM, and up to 552 I/Os makes it well suited for complex digital systems, multi‑channel aggregation, and memory‑heavy processing tasks.

Designed for industrial temperature operation and supplied in a high‑density 1152‑ball BGA package, this device supports robust system designs where environmental range, integration density, and on‑board performance are primary concerns. Choosing this part gives designers access to the Stratix V GX series capabilities documented in the device datasheet and a platform that scales for demanding embedded and industrial applications.

Request a quote or submit an inquiry for pricing, availability, and lead‑time information to evaluate 5SGXEA5H3F35I3G for your next design.