5SGXEA5H3F35C3N

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA

Quantity 860 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5H3F35C3N – Stratix® V GX Field Programmable Gate Array (FPGA), 490,000 logic elements, 552 I/Os

The 5SGXEA5H3F35C3N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, delivering very large programmable logic capacity and on-chip memory in a high-density FCBGA package. It combines approximately 490,000 logic elements with roughly 46.08 Mbits of embedded RAM and 552 device I/Os to support complex, high-density FPGA designs.

Engineered for commercial applications, this device is targeted at designs that require extensive logic resources, significant embedded memory, and a large I/O footprint in a surface-mount 1152-BBGA (35×35) package.

Key Features

  • Logic Capacity  Approximately 490,000 logic elements to implement large-scale digital designs and complex custom logic.
  • Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for buffering, data storage, and state machine implementations.
  • I/O Density  552 available device I/Os to accommodate broad peripheral connectivity and multi-channel interfaces.
  • Package  1152-BBGA, FCBGA (supplier device package: 1152-FBGA, 35×35) optimized for high-pin-count, dense system boards; surface-mount mounting type.
  • Power Supply  Core voltage supply range of 820 mV to 880 mV for precise core power management.
  • Operating Grade & Temperature  Commercial grade device rated for 0 °C to 85 °C operation.
  • Series-Level Transceiver Options  As a Stratix V GX family device, the series offers configurable transceiver speed grades and extensive I/O timing and programmable I/O element capabilities as documented in the Stratix V device datasheet.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High-density signal processing  Large logic and memory resources enable implementation of FPGA-based DSP, packet processing, and complex algorithm acceleration.
  • High-channel I/O systems  A 552-pin I/O count supports multi-lane interfaces, data aggregation, and complex board-level connectivity.
  • Embedded compute and prototyping  High logic element count and abundant RAM make the device suitable for system prototyping and embedded compute tasks that require programmable parallelism.
  • Communications and protocol bridging  Stratix V GX series transceiver and I/O timing capabilities (documented at the series level) support implementation of high-speed protocol logic and interface bridging.

Unique Advantages

  • High programmable density:  Approximately 490,000 logic elements provide the headroom needed for large-scale FPGA implementations, reducing the need for multi-device partitioning.
  • Substantial on-chip RAM:  Around 46.08 Mbits of embedded RAM helps keep latency-critical buffering and state storage on-chip, improving performance and simplifying board design.
  • Extensive I/O footprint:  552 I/Os give designers flexibility to connect multiple peripherals and interfaces without external expanders.
  • Compact, high-pin package:  1152-BBGA FCBGA (35×35) package balances pin count and board area for dense system integration.
  • Commercial temperature rating:  0 °C to 85 °C operating range suitable for standard commercial electronic products and systems.
  • Manufacturer backing:  Part of the Stratix V GX family with detailed electrical and switching characteristics documented in the Stratix V device datasheet.

Why Choose 5SGXEA5H3F35C3N?

The 5SGXEA5H3F35C3N positions itself as a high-capacity, commercial-grade FPGA for applications that demand extensive programmable logic, substantial embedded memory, and a large I/O complement in a high-density FCBGA package. Its combination of logic elements, on-chip RAM, and I/O makes it well suited to complex digital signal processing, multi-interface communication logic, and large-scale embedded designs.

Backed by Intel’s Stratix V GX family documentation, this device is a practical choice for designers seeking scalable logic resources and documented electrical characteristics for system-level integration and power planning.

Request a quote or submit a purchase inquiry to obtain pricing, lead times, and availability for the 5SGXEA5H3F35C3N. Technical documentation is available in the Stratix V device datasheet for detailed electrical and switching specifications.

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