5SGXEA5H3F35C3N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 860 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXEA5H3F35C3N – Stratix® V GX Field Programmable Gate Array (FPGA), 490,000 logic elements, 552 I/Os
The 5SGXEA5H3F35C3N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, delivering very large programmable logic capacity and on-chip memory in a high-density FCBGA package. It combines approximately 490,000 logic elements with roughly 46.08 Mbits of embedded RAM and 552 device I/Os to support complex, high-density FPGA designs.
Engineered for commercial applications, this device is targeted at designs that require extensive logic resources, significant embedded memory, and a large I/O footprint in a surface-mount 1152-BBGA (35×35) package.
Key Features
- Logic Capacity Approximately 490,000 logic elements to implement large-scale digital designs and complex custom logic.
- Embedded Memory Approximately 46.08 Mbits of on-chip RAM for buffering, data storage, and state machine implementations.
- I/O Density 552 available device I/Os to accommodate broad peripheral connectivity and multi-channel interfaces.
- Package 1152-BBGA, FCBGA (supplier device package: 1152-FBGA, 35×35) optimized for high-pin-count, dense system boards; surface-mount mounting type.
- Power Supply Core voltage supply range of 820 mV to 880 mV for precise core power management.
- Operating Grade & Temperature Commercial grade device rated for 0 °C to 85 °C operation.
- Series-Level Transceiver Options As a Stratix V GX family device, the series offers configurable transceiver speed grades and extensive I/O timing and programmable I/O element capabilities as documented in the Stratix V device datasheet.
- Environmental Compliance RoHS compliant.
Typical Applications
- High-density signal processing Large logic and memory resources enable implementation of FPGA-based DSP, packet processing, and complex algorithm acceleration.
- High-channel I/O systems A 552-pin I/O count supports multi-lane interfaces, data aggregation, and complex board-level connectivity.
- Embedded compute and prototyping High logic element count and abundant RAM make the device suitable for system prototyping and embedded compute tasks that require programmable parallelism.
- Communications and protocol bridging Stratix V GX series transceiver and I/O timing capabilities (documented at the series level) support implementation of high-speed protocol logic and interface bridging.
Unique Advantages
- High programmable density: Approximately 490,000 logic elements provide the headroom needed for large-scale FPGA implementations, reducing the need for multi-device partitioning.
- Substantial on-chip RAM: Around 46.08 Mbits of embedded RAM helps keep latency-critical buffering and state storage on-chip, improving performance and simplifying board design.
- Extensive I/O footprint: 552 I/Os give designers flexibility to connect multiple peripherals and interfaces without external expanders.
- Compact, high-pin package: 1152-BBGA FCBGA (35×35) package balances pin count and board area for dense system integration.
- Commercial temperature rating: 0 °C to 85 °C operating range suitable for standard commercial electronic products and systems.
- Manufacturer backing: Part of the Stratix V GX family with detailed electrical and switching characteristics documented in the Stratix V device datasheet.
Why Choose 5SGXEA5H3F35C3N?
The 5SGXEA5H3F35C3N positions itself as a high-capacity, commercial-grade FPGA for applications that demand extensive programmable logic, substantial embedded memory, and a large I/O complement in a high-density FCBGA package. Its combination of logic elements, on-chip RAM, and I/O makes it well suited to complex digital signal processing, multi-interface communication logic, and large-scale embedded designs.
Backed by Intel’s Stratix V GX family documentation, this device is a practical choice for designers seeking scalable logic resources and documented electrical characteristics for system-level integration and power planning.
Request a quote or submit a purchase inquiry to obtain pricing, lead times, and availability for the 5SGXEA5H3F35C3N. Technical documentation is available in the Stratix V device datasheet for detailed electrical and switching specifications.

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