5SGXEA5H3F35C2LN

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA

Quantity 286 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5H3F35C2LN – Stratix® V GX FPGA (490,000 logic elements, ~46.08 Mbits RAM)

The 5SGXEA5H3F35C2LN is a Stratix® V GX field-programmable gate array (FPGA) from Intel, delivered in a 1152-ball FCBGA package. It provides a high-density programmable fabric with large on-chip memory and a high I/O count for complex digital designs in commercial temperature applications.

Designed for advanced system integration, this device targets applications that require substantial logic resources, extensive embedded RAM, and a high number of external I/Os while operating within a commercial temperature range.

Key Features

  • Programmable Logic Capacity — Approximately 490,000 logic elements (cells) to implement large-scale digital logic and custom hardware functions.
  • Embedded Memory — Approximately 46.08 Mbits of on-chip RAM for buffers, FIFOs, and temporary data storage directly inside the FPGA fabric.
  • High I/O Count — 552 user I/O pins enabling many parallel interfaces and multi-lane connectivity to external devices and boards.
  • Package & Mounting — 1152-ball FCBGA package (1152-FBGA, 35 × 35) with surface-mount mounting, suitable for compact, high-density board layouts.
  • Supply Voltage — Core supply range specified at 820 mV to 880 mV, supporting the device's core operating requirements.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial embedded and communications equipment.
  • Standards Compliance — RoHS compliant, meeting common lead-free and environmental requirements for commercial electronics.
  • Documented Electrical & Switching Characteristics — Supported by the Stratix V device datasheet covering operating conditions, power, I/O timing, and switching behavior for GX devices.

Typical Applications

  • High-density digital systems — Implement complex control logic, datapaths, and custom hardware accelerators using the large logic and memory resources.
  • Interface aggregation and bridging — Use the abundant I/O to connect multiple peripherals, sensors, or high-pin-count daughtercards in embedded systems.
  • Prototyping and system integration — Rapidly iterate and validate large-scale designs that require substantial programmable fabric and embedded memory.
  • Communications and networking equipment (commercial) — Integrate packet processing, buffering, and custom protocol logic within a single device footprint for commercial network appliances.

Unique Advantages

  • Large programmable fabric: Approximately 490,000 logic elements enable consolidation of multiple functions into one device, reducing board-level complexity.
  • Significant on-chip memory: Approximately 46.08 Mbits of embedded RAM supports deep buffering and storage without external memory.
  • High pin-count connectivity: 552 I/Os provide flexible interfacing options for parallel buses, multiple serial lanes, and mixed-signal front ends.
  • Compact FCBGA package: 1152-ball FCBGA (35 × 35) provides a high I/O density in a surface-mount package suitable for space-constrained PCBs.
  • Commercial temperature rating: Designed for reliable operation across the 0 °C to 85 °C range common to commercial products and applications.
  • RoHS compliance: Meets lead-free environmental requirements for commercial manufacturing and distribution.

Why Choose 5SGXEA5H3F35C2LN?

The 5SGXEA5H3F35C2LN combines a very large logic capacity with substantial embedded memory and a high I/O count in a compact FCBGA package, making it well suited to demanding commercial designs that require integration of multiple functions on a single FPGA. Its documented electrical and switching characteristics in the Stratix V datasheet support engineering evaluation and system-level integration.

This device is ideal for engineering teams building high-density digital systems, complex interface aggregation solutions, or prototypes that benefit from a large, flexible programmable fabric and considerable on-chip RAM. RoHS compliance and standard commercial temperature qualification help streamline manufacturing and deployment in commercial products.

Please request a quote or submit an inquiry to get pricing, availability, and lead-time information for 5SGXEA5H3F35C2LN. Technical documentation, including the Stratix V device datasheet, is available to support design evaluation and integration.

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