5SGXEA5H3F35C3WN

The 5SGXEA5H3F35C3WN is a Stratix V GX field programmable gate array (FPGA) in a 1152‑BBGA (FCBGA) package, offered as a commercial‑grade device. It provides high-density programmable logic with substantial on‑chip memory and a large I/O count for demanding digital designs.

This device is built for designs that require significant logic capacity, embedded RAM, and extensive I/O. Core supply requirements and commercial temperature rating are provided to support board‑level integration and system planning.

Key Features

• High Logic Density  Approximately 490,000 logic elements for complex digital designs and large FPGA implementations.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM to support buffering, packet processing, and data‑intensive functions.
• Extensive I/O  Up to 552 user I/O pins to connect multiple peripherals, buses, and high‑pin‑count interfaces.
• Transceiver Capability (series)  Stratix V GX family transceivers are documented at series speeds up to 14.1 Gbps (series‑level datasheet information).
• Power and Supply  Core voltage supply range specified at 820 mV to 880 mV to guide power‑rail design.
• Package and Mounting  1152‑BBGA (FCBGA) package, supplier device package 1152‑FBGA (35×35); surface‑mount device for standard PCB assembly.
• Commercial Temperature Grade  Operating range 0 °C to 85 °C for commercial applications.
• Environmental Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High‑performance networking and communications: Use the Stratix V GX transceiver family capabilities and abundant I/O to implement high‑speed serial links and packet processing functions (series‑level transceiver data available in the datasheet).
• Data processing and acceleration: Large logic element count and substantial on‑chip RAM make the device suitable for custom accelerators and data‑path implementations that require dense programmable logic and embedded memory.
• I/O‑centric systems: Up to 552 I/Os support complex board‑level connectivity for multi‑interface systems and peripheral aggregation.

Unique Advantages

• High integration density: ~490k logic elements enable consolidation of multiple functions into a single device, reducing system complexity.
• Significant on‑chip memory: ~46.08 Mbits of embedded RAM reduces external memory dependence for many buffering and storage tasks.
• Large I/O complement: 552 I/Os facilitate extensive peripheral and bus interfacing without external expander logic.
• Ready for surface‑mount assembly: 1152‑BBGA FCBGA package and 35×35 supplier package footprint suit high‑density PCB layouts and automated assembly.
• Commercial grade operational window: 0 °C to 85 °C rating aligns with mainstream commercial system requirements.
• Regulatory alignment: RoHS compliance supports environmentally conscious product development and manufacturing.

Why Choose 5SGXEA5H3F35C3WN?

The 5SGXEA5H3F35C3WN positions itself as a high‑density Stratix V GX FPGA option for commercial designs that demand large programmable logic capacity, substantial embedded RAM, and broad I/O capability in a compact FCBGA package. Its documented series transceiver performance and explicit electrical parameters support system‑level planning and integration.

This device is suited for customers building complex digital systems that require consolidation of functions, flexible I/O mapping, and significant on‑chip memory, while operating within commercial temperature limits and standard surface‑mount assembly processes.

Request a quote or submit an inquiry today to discuss availability, lead times, and how the 5SGXEA5H3F35C3WN can fit your next high‑density FPGA design.