5SGXEA5H3F35C4N

The 5SGXEA5H3F35C4N is a Stratix V GX field-programmable gate array (FPGA) from Intel, supplied in a 1152-FBGA (35×35) surface-mount package. It delivers a high logic capacity and substantial embedded memory for complex digital designs.

Targeted for commercial-grade applications, this device combines approximately 490,000 logic elements with around 46 Mbits of embedded RAM, 552 I/O pins, and a low-voltage core supply range to support dense, high-function designs where integration and configurability are critical.

Key Features

• Logic Capacity  Approximately 490,000 logic elements to implement large, complex logic designs.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data storage.
• I/O Density  552 user I/O pins provide broad external connectivity for peripherals, interfaces, and board-level signals.
• Package & Mounting  1152-BBGA (FCBGA) / 1152-FBGA (35×35) surface-mount package for high-density PCB integration.
• Power  Core voltage supply range: 820 mV to 880 mV, enabling operation within a defined low-voltage core domain.
• Thermal / Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant.
• Vendor & Series  Part of the Stratix V GX family from Intel (series datasheet provides device electrical and switching characteristics and transceiver/periphery details).

Typical Applications

• High-capacity digital logic  Implement large-scale, configurable logic functions where hundreds of thousands of logic elements and substantial embedded RAM are required.
• High-density I/O systems  Use the 552 I/O pins to interface with multiple peripherals, daughter cards, or high-pin-count board-level connectors.
• Compact, surface-mount designs  The 1152-FBGA package enables dense PCB layouts for space-constrained commercial equipment.

Unique Advantages

• High integration density: Nearly 490,000 logic elements and substantial on-chip RAM reduce the need for external logic and memory, simplifying board design.
• Large on-chip memory: Approximately 46 Mbits of embedded RAM supports data buffering and on-chip storage, lowering external memory dependencies.
• Extensive I/O capability: 552 I/O pins enable flexible interfacing and system partitioning without additional I/O expanders.
• Compact package footprint: 1152-FBGA (35×35) surface-mount package supports high-density PCBs while maintaining robust connectivity.
• Commercial temperature operation: Rated 0 °C to 85 °C for deployment in standard commercial environments.
• Low-voltage core domain: 0.820–0.880 V supply range supports modern low-voltage power architectures.

Why Choose 5SGXEA5H3F35C4N?

This Stratix V GX FPGA offers a combination of high logic density, ample embedded memory, and significant I/O resources in a compact 1152-FBGA surface-mount package—making it suitable for commercial-grade designs that require substantial on-chip resources and flexible connectivity. As part of the Stratix V GX family from Intel, the device aligns with series-level electrical and switching characteristics documented in the vendor datasheet.

Choosing the 5SGXEA5H3F35C4N provides a scalable platform for complex FPGA implementations where integration, configurability, and on-chip memory are prioritized. RoHS compliance and the specified operating and power ranges enable predictable integration into commercial hardware designs.

Request a quote or submit a pricing and availability request to obtain lead-time and ordering information for 5SGXEA5H3F35C4N.