5SGXEA5H3F35I3LN

The 5SGXEA5H3F35I3LN is a Stratix V GX family field-programmable gate array (FPGA) designed for high-density digital integration. This industrial-grade device provides a large programmable fabric, extensive embedded memory, and a wide set of I/O resources to address demanding system designs in communications, signal processing, and industrial applications.

With 490,000 logic elements and approximately 46.08 Mbits of on-chip RAM, the device is suited for designs that require substantial logic capacity, multi‑lane I/O connectivity, and robust operation across an industrial temperature range.

Key Features

• Core Logic 490,000 logic elements (logic cells) to implement complex digital functions and custom compute pipelines.
• Embedded Memory Approximately 46.08 Mbits of total on-chip RAM to support large buffering, lookup tables, and state storage.
• I/O Density 552 I/O pins to enable wide parallel interfaces and multi-channel connectivity for high-pin-count systems.
• Power Supply Core voltage supply range of 820 mV to 880 mV to match system power delivery and allow precise power budgeting.
• Package & Mounting Supplied in a 1152‑BBGA (1152‑FBGA, 35 × 35) FCBGA package for surface-mount assembly and high pin density.
• Temperature Grade Industrial operating temperature range from −40 °C to 100 °C for reliable use in rugged environments.
• Regulatory RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Network & Communications Equipment — Use the device’s large logic capacity and high I/O count for packet processing, protocol offload, and multi-lane interface aggregation.
• High‑Performance Signal Processing — Implement DSP algorithms and data pipelines leveraging abundant logic and embedded memory for buffering and intermediate storage.
• Industrial Control Systems — Industrial temperature rating and extensive I/O make this FPGA suitable for control, motor drives, and machine-automation platforms.
• Custom Compute & Prototyping — Large programmable fabric supports hardware acceleration, prototyping complex SoC functions, and evaluating system-level architectures.

Unique Advantages

• High integration density: 490,000 logic elements and ~46.08 Mbits of embedded RAM reduce external component count by consolidating logic and memory on-chip.
• Broad I/O capability: 552 I/Os enable flexible connectivity to sensors, transceivers, and multi-channel interfaces without extensive multiplexing.
• Industrial robustness: Rated for −40 °C to 100 °C operation, supporting deployment in industrial and harsh environmental conditions.
• Compact, high‑pin package: 1152‑FBGA (35 × 35) footprint offers high pin density for complex boards while remaining surface-mount friendly.
• Low-voltage core operation: 820–880 mV supply range supports modern power-optimized system designs and careful thermal planning.
• RoHS compliance: Meets common environmental manufacturing standards for streamlined production and sourcing.

Why Choose 5SGXEA5H3F35I3LN?

The 5SGXEA5H3F35I3LN combines a large programmable fabric with substantial on-chip memory and extensive I/O to address complex, high-density designs that demand deterministic hardware performance. Its industrial temperature rating and compliant package make it a practical choice for systems that require both performance and operational robustness.

This FPGA is aimed at engineering teams building high-throughput communications gear, industrial automation platforms, and custom compute solutions that benefit from consolidated logic, flexible interfacing, and scalable hardware architecture.

Request a quote or submit a procurement inquiry to check availability, pricing, and lead times for the 5SGXEA5H3F35I3LN.