5SGXEA5H3F35I4N

The 5SGXEA5H3F35I4N is a Stratix® V GX field-programmable gate array (FPGA) offered in an industrial temperature grade and a 1152-BBGA FCBGA package. It delivers large programmable logic capacity, substantial on-chip RAM, and a high I/O count for designs that require significant integration and board-level connectivity.

As a member of the Stratix V GX family, this device aligns with high-density digital designs that need extensive logic resources, embedded memory, and a broad complement of I/Os while operating across an industrial temperature range.

Key Features

• Core logic capacity — Provides 490,000 logic elements and 185,000 logic array blocks as specified for implementing complex digital functions.
• Embedded memory — Approximately 46 Mbits of embedded memory (46,080,000 total RAM bits) to support buffering, DSP, and state storage on-chip.
• I/O density & connectivity — Up to 552 I/O pins for extensive board-level interfacing and system integration.
• Stratix V GX family transceiver capability — As a Stratix V GX device, it is part of a family that includes high-speed transceiver speed grades; refer to the series documentation for transceiver-grade specifics.
• Power and supply — Core supply operating range from 820 mV to 880 mV to match system power-rail requirements.
• Package & mounting — 1152-BBGA FCBGA (supplier package: 1152-FBGA, 35 × 35 mm) in a surface-mount form factor for dense board layouts.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory status — RoHS compliant.

Typical Applications

• High-density digital processing — Large logic and embedded memory resources enable implementation of complex state machines, custom accelerators, and wide datapaths.
• High I/O systems — 552 I/Os support dense board-level interconnect, multi-channel front-ends, and complex control planes.
• Communications and networking equipment — As part of the Stratix V GX family, the device is suited for designs requiring high-speed I/O and transceiver-capable architectures.

Unique Advantages

• High logic integration: 490,000 logic elements reduce the need for multiple devices by consolidating functionality into a single FPGA.
• Substantial on-chip RAM: Approximately 46 Mbits of embedded memory supports large buffers, lookup tables, and data caching without external memory.
• Extensive I/O count: 552 I/Os allow flexible interfacing to a variety of peripherals, sensors, and high-density connectors.
• Industrial-grade operation: Rated −40 °C to 100 °C for reliable use in industrial temperature environments.
• Compact, high-density package: 1152-BBGA FCBGA (35 × 35 mm supplier package) enables high pin count in a compact surface-mount footprint.
• Standards-compliant materials: RoHS compliance supports environmentally regulated product assemblies.

Why Choose 5SGXEA5H3F35I4N?

This Stratix V GX device combines large programmable logic capacity, significant embedded memory, and a very high I/O count in a compact surface-mount FCBGA package rated for industrial temperatures. It is positioned for system designs that require consolidation of complex logic, on-chip buffering, and extensive board-level connectivity while meeting RoHS requirements.

Designers targeting high-density digital processing, communications, or I/O-heavy systems will find the 5SGXEA5H3F35I4N suitable for scalable, high-integration implementations where power-rail compatibility (820–880 mV core supply) and industrial temperature operation are important.

If you would like pricing, availability, or a formal quote for 5SGXEA5H3F35I4N, submit a request to receive a competitive quote and technical support details.