5SGXEA5H3F35I3LG

The 5SGXEA5H3F35I3LG is an Intel Stratix V GX field programmable gate array (FPGA) IC offering 490,000 logic elements and approximately 46 Mbits of embedded memory. This device is supplied in a 1152‑BBGA FCBGA package (1152‑FBGA, 35×35) and is designed for surface‑mount PCB assembly.

Targeted for industrial applications, the device provides a broad I/O count (552 I/Os), a low core voltage range (0.820 V to 0.880 V), and an operating temperature range of −40 °C to 100 °C. As a member of the Stratix V GX family, it is positioned for high‑density, high‑integration digital designs that require substantial on‑chip memory and extensive I/O.

Key Features

• High‑density logic — 490,000 logic elements to implement large-scale digital designs and complex FPGA architectures.
• Embedded memory — Approximately 46 Mbits of on‑chip RAM for buffering, packet processing, or local data storage.
• Extensive I/O — 552 user I/Os to support wide parallel interfaces and multi‑lane connectivity.
• Power and core voltage — Core supply voltage range of 0.820 V to 0.880 V to match platform power architectures.
• Industrial temperature grade — Specified operating range from −40 °C to 100 °C for use in industrial environments.
• Package and mounting — 1152‑BBGA (1152‑FBGA, 35×35) FCBGA package; surface‑mount mounting type for standard SMT assembly.
• Compliance — RoHS‑compliant device to meet environmental regulations.

Typical Applications

• Industrial control systems — High logic density and industrial temperature rating enable complex control, real‑time processing, and robust operation in factory or process environments.
• High‑throughput networking and communications — Large logic capacity, substantial embedded memory, and Stratix V GX family transceiver orientation support dense packet processing and multiport interfaces.
• Hardware acceleration and signal processing — On‑chip RAM and extensive logic resources make the device suitable for custom accelerators, DSP pipelines, and data manipulation tasks.
• System integration and prototyping — A broad I/O complement and high logic count simplify integration of complex subsystems and rapid iteration of hardware designs.

Unique Advantages

• High integration density: 490,000 logic elements reduce external component count and consolidate complex functions on a single device.
• Significant on‑chip memory: Approximately 46 Mbits of embedded RAM enable large buffers and localized data storage without external memory in many designs.
• Large I/O footprint: 552 I/Os provide flexibility for parallel interfaces, wide buses, and multiple peripheral connections.
• Industrial reliability: Specified for −40 °C to 100 °C operation to support equipment deployed in harsh or temperature‑variable environments.
• Compact SMT package: 1152‑BBGA FCBGA in a 35×35 format supports dense board layouts while maintaining a repeatable surface‑mount assembly process.
• Regulatory compliance: RoHS compliance assists with regulatory and environmental requirements for modern electronic products.

Why Choose 5SGXEA5H3F35I3LG?

The 5SGXEA5H3F35I3LG positions itself as a high‑density Stratix V GX FPGA for industrial applications that demand large logic capacity, substantial on‑chip memory, and extensive I/O in a compact FCBGA package. Its voltage and temperature specifications make it suitable for designs that require low core‑voltage operation and robust performance across a wide thermal range.

Designers seeking a scalable, high‑integration FPGA element for complex digital systems, networking subsystems, or hardware acceleration can leverage the combination of logic density, embedded RAM, and I/O resources this device provides while maintaining compliance with environmental requirements.

Request a quote or submit a pricing inquiry today to evaluate the 5SGXEA5H3F35I3LG for your next high‑density FPGA design.