5SGXEA5H3F35I3L
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 222 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXEA5H3F35I3L – Stratix® V GX FPGA, 490,000 logic elements, 552 I/Os
The 5SGXEA5H3F35I3L is an Intel Stratix V GX field‑programmable gate array (FPGA) device providing very high logic density and abundant embedded memory for complex digital designs. It combines 490,000 logic elements with approximately 46 Mbits of on‑chip RAM and a large 552‑pin I/O budget to support designs that require dense logic, substantial memory, and high I/O integration.
Manufactured in a 1152‑BBGA / 1152‑FBGA (35×35) package and rated for industrial temperature operation, this surface‑mount FPGA is suited to applications that demand integration, deterministic operating conditions, and RoHS compliance.
Key Features
- Core logic density — 490,000 logic elements (cells) to implement large FPGA designs and complex FPGA fabric implementations.
- Embedded memory — Approximately 46 Mbits of on‑chip RAM for data buffering, packet storage, and local memory-intensive functions.
- High I/O count — 552 user I/Os to support extensive parallel interfaces, peripheral connections, and board‑level integration.
- Package and mounting — 1152‑BBGA / FCBGA in a supplier package of 1152‑FBGA (35×35); surface‑mount mounting for standard PCB assembly.
- Power supply range — Core voltage supply specified from 820 mV to 880 mV for the device core.
- Operating temperature — Industrial grade operation from −40 °C to 100 °C for extended temperature environments.
- Standards compliance — RoHS compliant manufacturing.
- Series-level capabilities — As a Stratix V GX device, the family includes engineered transceiver and I/O timing characteristics (series documentation describes transceiver and programmable I/O timing for Stratix V GX devices).
Typical Applications
- High‑density digital processing — Implement large custom logic blocks and complex state machines where large logic element counts and rich on‑chip memory are required.
- High‑I/O systems — Drive multiple parallel interfaces, front‑end connectors, and board‑level peripherals using the device’s 552 I/O pins and programmable I/O timing.
- Memory‑centric designs — Use the approximately 46 Mbits of embedded RAM for buffering, queuing, and on‑chip data storage in packet or streaming applications.
- Industrial control and automation — Industrial temperature rating (−40 °C to 100 °C) and surface‑mount packaging make this FPGA suitable for robust embedded control systems.
Unique Advantages
- High logic and memory integration: Combine 490,000 logic elements with approximately 46 Mbits of embedded memory to reduce external component count and simplify board design.
- Substantial I/O capacity: 552 I/Os enable extensive peripheral interfacing, sensor arrays, and parallel data paths without sacrificing board space.
- Industrial temperature range: Rated from −40 °C to 100 °C to support designs intended for extended operating environments.
- Compact FCBGA package: 1152‑BBGA / 1152‑FBGA (35×35) packaging delivers high pin count in a compact surface‑mount footprint for dense PCB layouts.
- Controlled core supply range: Core voltage specified between 820 mV and 880 mV to support predictable power provisioning and thermal planning.
- RoHS compliant: Manufactured to meet RoHS requirements for environmental and regulatory compliance.
Why Choose 5SGXEA5H3F35I3L?
The 5SGXEA5H3F35I3L positions itself as a high‑density, industrial‑grade FPGA option within the Stratix V GX family, delivering a combination of large logic capacity, significant embedded RAM, and a high I/O count in a compact FCBGA package. Its industrial temperature rating and defined core voltage range make it suitable for systems where environmental robustness and clear power requirements are essential.
This device is appropriate for engineering teams designing complex, memory‑intensive digital systems that require consolidation of logic and I/O onto a single programmable device, offering a scalable platform aligned with the Stratix V GX series documentation and device characteristics.
Request a quote today to receive pricing and availability for the 5SGXEA5H3F35I3L Stratix V GX FPGA and to discuss lead times for your design needs.

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