5SGXEA5H3F35C2G

The 5SGXEA5H3F35C2G is a Stratix® V GX family Field Programmable Gate Array (FPGA) offered in a commercial temperature grade. This high-density FPGA integrates approximately 490,000 logic elements and roughly 46 Mbits of on-chip RAM, making it suitable for designs that require significant programmable logic capacity and embedded memory.

With 552 general-purpose I/O pins, an FCBGA 1152‑ball package (1152‑FBGA (35×35)) and a low-voltage core supply range of 870 mV to 930 mV, this device targets applications that need high I/O density and advanced integration in a surface-mount form factor.

Key Features

• High-density logic  Approximately 490,000 logic elements to implement large, complex digital designs and custom logic subsystems.
• On-chip memory  Approximately 46 Mbits of embedded RAM to support buffering, FIFOs, and memory-intensive processing without external memory for many use cases.
• IO capacity  552 I/O pins to support dense connectivity and multiple parallel interfaces directly from the FPGA.
• Power and core voltage  Core supply range of 870 mV to 930 mV for proper power provisioning and board-level power planning.
• Commercial temperature grade  Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Package and mounting  1152‑BBGA FCBGA package (supplier device package: 1152‑FBGA (35×35)) with surface-mount mounting for compact PCB integration.
• Regulatory  RoHS compliant, supporting lead-free manufacturing flows.

Typical Applications

• High-density logic systems  Implement large-scale programmable digital engines and custom datapaths that require extensive logic resources and embedded memory.
• I/O‑intensive designs  Drive systems with many parallel interfaces or mixed I/O requirements using the device’s 552 available I/O pins.
• Embedded memory processing  Leverage approximately 46 Mbits of on-chip RAM for buffering, packet processing, or storage of working data in FPGA-accelerated tasks.

Unique Advantages

• Substantial logic capacity: Approximately 490,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Large embedded memory: Around 46 Mbits of RAM lowers dependence on external memory for many buffering and data‑path tasks, simplifying BOM and layout.
• High I/O density: 552 I/O signals support complex system interfaces and high‑pin-count connectivity without external multiplexing hardware.
• Compact surface-mount package: The 1152‑FBGA (35×35) package provides high integration density for space-constrained PCBs while maintaining robust ball-grid connectivity.
• Commercial-grade operating range: Rated for 0 °C to 85 °C to match typical commercial deployment and testing environments.
• RoHS compliant: Supports modern, lead‑free manufacturing and regulatory requirements.

Why Choose 5SGXEA5H3F35C2G?

The 5SGXEA5H3F35C2G delivers a blend of high logic density, substantial on-chip memory, and broad I/O capacity in a surface-mount 1152‑FBGA package. It is positioned for designs that require consolidated programmable logic, extensive embedded memory, and multiple interfaces within a commercial temperature envelope.

Engineers and procurement teams looking for a well-specified Stratix V GX family device will find this part appropriate for high-capacity FPGA implementations where integration density, I/O count, and RoHS compliance are key selection criteria.

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