5SGXEA5H2F35I3LN

The 5SGXEA5H2F35I3LN is a Stratix V GX field-programmable gate array (FPGA) in a 1152-ball BGA FCBGA package. It provides large on-chip logic and memory resources with a high I/O count, targeted at designs that require dense programmable logic and extensive interfacing.

As an industrial-grade device, this Stratix V GX FPGA delivers a combination of core capacity, embedded RAM, and I/O density suitable for complex digital systems and I/O‑intensive applications that must operate across a wide temperature range.

Key Features

• Core Density  Approximately 490,000 logic elements, supporting complex programmable logic implementations.
• Logic Blocks  Approximately 185,000 logic blocks (LABs/CLBs equivalent) for scalable logic partitioning and resource allocation.
• Embedded Memory  Approximately 46.08 Mbits of embedded RAM for on-chip buffering, state storage, and data processing tasks.
• I/O Capacity  552 user I/O pins to support extensive peripheral and system interfacing requirements.
• Power Supply  Core voltage range of 820 mV to 880 mV, enabling defined operating conditions for core logic.
• Package and Mounting  1152‑BBGA FCBGA package (supplier package: 1152‑FBGA, 35×35); surface-mount device suitable for modern PCB assembly.
• Operating Temperature  Industrial temperature grade rated from –40 °C to 100 °C for extended-environment deployments.
• RoHS Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-density digital processing  Implements complex logic functions and data-paths using the large pool of logic elements and embedded RAM.
• I/O-intensive systems  Supports designs requiring many external interfaces or parallel signaling with its 552 I/O pins.
• Protocol and interface aggregation  On-chip memory and logic density enable buffering and aggregation of multiple channels or interfaces within a single FPGA.

Unique Advantages

• Substantial logic resources: The combination of approximately 490,000 logic elements and ~185,000 logic blocks enables integration of complex functions on a single device, reducing board-level BOM.
• Large on-chip memory: Approximately 46.08 Mbits of embedded RAM supports local buffering and stateful processing without external memory for many applications.
• High I/O count: 552 I/Os simplify system partitioning by enabling direct connection to multiple peripherals and high‑speed interfaces.
• Industrial operating range: Rated from –40 °C to 100 °C for deployments that require broader temperature tolerance.
• Standard BGA package: 1152-ball FCBGA (35×35) packaging provides a compact, surface-mount form factor compatible with modern assembly flows.
• Regulatory readiness: RoHS compliance supports environmentally conscious product builds.

Why Choose 5SGXEA5H2F35I3LN?

This Stratix V GX FPGA combines high logic density, substantial embedded memory, and a large number of I/Os in an industrial‑grade, surface‑mount BGA package. It is suited to engineers building complex, I/O-rich systems that benefit from consolidating functions into a single programmable device.

The device’s specification set—large logic and RAM resources, industrial temperature rating, and robust packaging—offers a balanced platform for scalable designs where integration, thermal tolerance, and interface capacity are priorities.

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