5SGXEA5H2F35I3

The 5SGXEA5H2F35I3 is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1152‑ball FCBGA package, offered in an industrial temperature grade. This device provides a high logic density and substantial on‑chip memory to support complex, high‑performance digital designs.

With 490,000 logic elements, approximately 46 Mbits of embedded memory, and 552 I/O pins, the device is suited to applications that require dense logic integration, large local storage, and extensive peripheral connectivity while operating across an industrial temperature range.

Key Features

• Logic Capacity  490,000 logic elements (cells) to implement complex custom logic and programmable functions.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM for buffering, lookup tables, and tightly coupled data storage.
• I/O Density  552 programmable I/O pins to support broad peripheral interfacing and multi‑lane I/O architectures.
• Package  1152‑FBGA (35 × 35 mm) FCBGA package (1152‑BBGA) for high‑density board integration.
• Power Supply  Core voltage range of 820 mV to 880 mV to match system power rails and core timing requirements.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards & Compliance  RoHS compliant, aligning with common environmental and manufacturing requirements.
• Stratix V GX Series Characteristics  Part of the Stratix V GX family; series documentation describes industrial and commercial speed grades and available transceiver options for high‑speed channel support.

Typical Applications

• High‑performance networking  Use the device for packet processing, switching fabric, and protocol bridging where dense logic and large on‑chip memory accelerate data handling.
• Telecommunications infrastructure  Deploy in baseband processing, fronthaul/backhaul interfaces, and other telecom equipment requiring many I/O and configurable logic.
• Industrial control and automation  Implement complex control algorithms and sensor/actuator interfaces, benefiting from the industrial temperature range and robust I/O count.
• Advanced test and measurement  Leverage the large logic capacity and memory to create custom signal processing pipelines and real‑time measurement functions.

Unique Advantages

• High logic density: 490,000 logic elements let you consolidate multi‑function designs into a single device, reducing board space and BOM complexity.
• Substantial on‑chip RAM: Approximately 46 Mbits of embedded memory enables large buffering and fast local data access without external memory overhead.
• Extensive I/O connectivity: 552 I/Os provide flexibility for wide parallel interfaces, multi‑lane connections, and rich peripheral integration.
• Industrial robustness: Rated from −40 °C to 100 °C for reliable operation in demanding environments where temperature tolerance is required.
• Board‑level integration: 1152‑FBGA package allows dense placement and simplified routing for compact, high‑pin‑count designs.
• Standards compliant: RoHS compliance supports environmentally conscious manufacturing and global supply chain requirements.

Why Choose 5SGXEA5H2F35I3?

The 5SGXEA5H2F35I3 positions itself as a high‑capacity Stratix V GX FPGA aimed at designs that require significant programmable logic, large embedded memory, and broad I/O connectivity within an industrial temperature envelope. Its combination of 490,000 logic elements and approximately 46 Mbits of RAM supports complex signal processing, protocol handling, and system consolidation.

Backed by Intel's Stratix V family documentation and device characterization, this FPGA is appropriate for engineering teams seeking a scalable, high‑density programmable device for networking, telecom, industrial automation, and advanced measurement systems.

Request a quote or submit your design requirements to get pricing and availability for the 5SGXEA5H2F35I3. Our team can provide volume pricing, lead‑time information, and technical assistance to evaluate the device for your application.