5SGXEA5H2F35I2N

The 5SGXEA5H2F35I2N is a Stratix® V GX Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It provides a large programmable fabric with high on-chip memory and a substantial I/O complement, packaged in a 1152‑BBGA (FCBGA) surface‑mount package.

Targeted at industrial applications that require a high density of logic resources, significant embedded memory, and broad I/O capability, this device combines scalable logic capacity with operating and supply ranges suited for demanding environments.

Key Features

• Logic Capacity  Approximately 490,000 logic elements for large, complex FPGA designs.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM to support buffering, lookup tables, and data storage within the fabric.
• I/O Density  552 user I/Os to accommodate wide external interfaces and parallel connectivity.
• Power/Core Supply  Core voltage supply range from 870 mV to 930 mV for the device core.
• Package & Mounting  1152‑BBGA (FCBGA) surface‑mount package; supplier device package identified as 1152‑FBGA (35×35).
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• RoHS Compliant  Device meets RoHS environmental requirements.

Typical Applications

• Industrial Control & Automation  Industrial temperature grading and high logic capacity support complex control algorithms and real‑time processing in automation systems.
• Communications & Networking  Large logic fabric, extensive embedded memory, and high I/O count enable protocol processing and interface aggregation in networking equipment.
• High‑Density Signal Processing  Substantial on‑chip RAM and logic resources facilitate DSP pipelines, buffering, and custom accelerators for signal processing tasks.

Unique Advantages

• High logic density: The device’s ~490,000 logic elements enable integration of large custom functions and complex state machines within a single FPGA.
• Substantial on‑chip memory: Approximately 46.08 Mbits of embedded RAM reduces dependence on external memory for many buffering and data‑storage needs.
• Broad I/O capability: 552 I/Os provide flexibility to implement multiple interfaces and parallel data paths without extensive external multiplexing.
• Industrial temperature support: Rated from −40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compact FCBGA packaging: 1152‑BBGA (1152‑FBGA supplier package, 35×35) surface‑mount package balances high pin count with a compact footprint for board‑level integration.
• Controlled core supply: Core supply range of 870–930 mV aligns with the device’s power requirements for predictable integration into power architectures.

Why Choose 5SGXEA5H2F35I2N?

The 5SGXEA5H2F35I2N combines large programmable logic capacity, significant embedded memory, and an extensive I/O complement in an industrial‑grade Stratix V GX device. These attributes make it suitable for designs that demand high integration density, robust thermal performance, and flexible interfacing.

For engineers and system designers building complex industrial, communications, or signal processing solutions, this FPGA offers the resource set needed to consolidate functions, reduce external components, and support scalable implementations backed by the Stratix V family datasheet guidance.

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