5SGXEA5H2F35I3LG

The 5SGXEA5H2F35I3LG is a Stratix® V GX field programmable gate array (FPGA) device designed for high-density, industrial-grade digital designs. It provides a large logic capacity and abundant on-chip memory combined with extensive I/O, making it suitable for complex signal processing, protocol handling, and high-channel-count systems.

Built for integration into performance-focused systems, this device delivers a balance of logic resources, embedded memory, and I/O bandwidth while meeting industrial temperature and RoHS compliance requirements.

Key Features

• Core Capacity  Approximately 490,000 logic elements for implementing large, complex digital designs and multi-function hardware accelerators.
• Embedded Memory  Approximately 46.08 Mbits of embedded RAM to support buffering, on-chip caches, and high-throughput data paths.
• I/O Resources  Up to 552 user I/Os to accommodate wide parallel interfaces and dense board-level connectivity.
• Transceiver Options (Series-Level)  Stratix V GX devices are documented with GX transceiver speed grades in the device family datasheet, providing high-speed channel options for serial interfaces.
• Power Supply  Core voltage supply range specified at 820 mV to 880 mV for the device core.
• Package & Mounting  1152-ball BGA (FCBGA) package, supplier package listed as 1152-FBGA (35×35), intended for surface-mount assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to support industrial environment deployments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-performance signal processing  Large logic capacity and substantial on-chip RAM enable complex DSP pipelines and real-time data manipulation.
• Telecommunications and networking  Extensive I/O and Stratix V GX transceiver options (as documented for the family) suit multi-channel packet processing and protocol offload tasks.
• Prototyping and hardware acceleration  Dense logic resources and embedded memory support prototyping of ASIC-bound functions or hardware acceleration in compute systems.

Unique Advantages

• Large, integrated logic fabric: The device’s approximately 490,000 logic elements reduce external glue logic and consolidate complex functions on a single chip.
• Significant on-chip memory: Approximately 46.08 Mbits of embedded RAM lowers reliance on external memory for buffering and stateful logic.
• High I/O density: 552 I/Os simplify board routing for parallel interfaces, sensor arrays, and multi-lane connections.
• Industrial operating range: Rated from −40 °C to 100 °C, enabling deployment in demanding environmental conditions.
• Compact system-level footprint: 1152-ball FCBGA packaging allows high-density board designs while maintaining surface-mount assembly compatibility.
• Standards-conscious sourcing: RoHS compliance supports regulatory and material-safety requirements.

Why Choose 5SGXEA5H2F35I3LG?

The 5SGXEA5H2F35I3LG positions itself as a high-capacity, industrial-grade FPGA choice for designers requiring substantial logic resources, embedded memory, and high I/O counts in a single, surface-mount package. Its documented Stratix V GX family characteristics and industrial temperature rating make it suitable for demanding applications where integration density and environmental robustness matter.

For teams building complex signal-processing blocks, protocol engines, or multi-channel interfaces, this device offers the resource set to consolidate functions, streamline board-level design, and scale projects while retaining compliance with RoHS requirements.

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