5SGXEA5H2F35I3N

The 5SGXEA5H2F35I3N is an industrial-grade Stratix® V GX field programmable gate array (FPGA) offering high logic density and substantial on-chip memory for complex digital designs. This device provides 490,000 logic elements and approximately 46 Mbits of embedded memory, paired with 552 general-purpose I/Os and a surface-mount 1152-BBGA (35×35) package.

Engineered for applications that require large-scale programmable logic, high I/O count, and extended temperature operation, the device supports operation from −40 °C to 100 °C and a core supply range of 820 mV to 880 mV.

Key Features

• High Logic Capacity — 490,000 logic elements to implement large, complex digital designs and multi-function systems.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM for buffering, state storage, and high-bandwidth internal data paths.
• Extensive I/O — 552 I/O pins to support dense peripheral connectivity and multiple parallel interfaces.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in demanding environmental conditions.
• Power Supply Range — Core voltage specified between 820 mV and 880 mV for defined power and timing behavior.
• Package & Mounting — 1152-BBGA, FCBGA (1152-FBGA, 35×35) surface-mount package suitable for high-density board designs.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly.

Typical Applications

• Industrial Control Systems — Use the large logic array and extensive I/O to consolidate multiple control functions and sensor interfaces in a single FPGA.
• High-Density Digital Processing — Implement complex signal processing, protocol bridging, or custom processing pipelines leveraging the large logic element count and embedded RAM.
• Communication Infrastructure — Deploy in systems that require many I/Os and significant on-chip memory for packet buffering and custom packet processing logic.

Unique Advantages

• Substantial Logic Resources: 490,000 logic elements enable implementation of large-scale, integrated functions and multi-core logic architectures.
• On-Chip Memory Capacity: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage tasks, simplifying board-level design.
• High I/O Count: 552 I/Os support rich peripheral connectivity and parallel interfaces, reducing the need for external multiplexing components.
• Industrial Thermal Range: Specified operation from −40 °C to 100 °C supports deployment in harsh or wide-temperature environments.
• Compact, Surface-Mount Packaging: The 1152-BBGA (35×35) package offers a compact footprint for high-density PCBs while supporting the device’s I/O and power requirements.
• Regulatory Compliance: RoHS compliance aids in meeting environmental and manufacturing requirements.

Why Choose 5SGXEA5H2F35I3N?

The 5SGXEA5H2F35I3N combines high logic density, substantial embedded memory, and a large I/O complement in an industrial-grade Stratix V GX FPGA package. It is suited to designs that require consolidating complex digital functions, handling significant internal buffering, and interfacing to many external signals while operating across a wide temperature range.

For engineers and procurement teams building robust, scalable systems, this device provides verifiable capacity and temperature performance, packaged for surface-mount assembly and compliant with RoHS. Its specification set supports long-term designs where logic density, memory, and I/O breadth are primary selection criteria.

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