5SGXEA5H2F35I3NCV

The 5SGXEA5H2F35I3NCV is a Stratix V GX FPGA from Intel designed for high-density, programmable digital logic. As a Stratix V GX-class device, it targets designs that combine large logic capacity with the Stratix V family’s transceiver-class capabilities (see the Stratix V device documentation for speed-grade options).

Key on-chip resources include 490,000 logic elements and approximately 46 Mbits of embedded memory, complemented by 552 user I/O and an industrial operating temperature range, making this device appropriate for demanding, high‑density applications.

Key Features

• Logic Capacity 490,000 logic elements for implementing complex digital systems and large-scale FPGA designs.
• Embedded Memory Approximately 46 Mbits of on-chip RAM to support buffering, FIFOs, and data- intensive processing.
• High I/O Count 552 user I/O pins to support wide parallel interfaces and extensive connectivity to peripherals and daughtercards.
• GX-Class Transceiver Capability Stratix V GX family transceiver speed grades are described in the Stratix V device datasheet for high-speed serial interface options.
• Powering Core voltage supply range of 820 mV to 880 mV to match Stratix V GX core power requirements.
• Package and Mounting 1152-BBGA (1152-FBGA, 35×35) FCBGA package, surface-mount mounting for standard PCB assembly processes.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for extended temperature environments.
• Standards Compliance RoHS compliant.

Typical Applications

• High-speed communications Suitable for systems that require high-density logic and Stratix V GX transceiver options for serial links (refer to datasheet for supported speed grades).
• Signal processing and compute acceleration Large logic and embedded memory resources support complex DSP pipelines and hardware acceleration tasks.
• Prototyping and custom SoC integration High logic element count and abundant I/O enable prototyping of custom ASIC functions and integration of multiple subsystems on a single device.

Unique Advantages

• Large programmable fabric: 490,000 logic elements allow implementation of substantial custom logic and multiple concurrent functions on-chip.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependency on external memory for buffering and intermediate data storage.
• Extensive I/O: 552 user I/O provide design flexibility for parallel interfaces, board-level routing, and mezzanine connectivity.
• Industrial temperature range: −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
• Standard FCBGA packaging: 1152-FBGA (35×35) package enables surface-mount assembly and compact board layouts.
• Compliance and supply parameters: RoHS compliance and a defined core voltage supply range (820 mV to 880 mV) simplify power planning and regulatory considerations.

Why Choose 5SGXEA5H2F35I3NCV?

This Stratix V GX device brings a combination of large logic capacity, substantial embedded memory, and a high I/O count tailored for demanding FPGA applications that require both density and flexibility. Its industrial temperature rating and standard FCBGA package make it suitable for robust, production-level designs.

Choose the 5SGXEA5H2F35I3NCV for designs that need scalable programmable logic resources, substantial on-chip RAM, and extensive connectivity; consult the Stratix V device documentation for transceiver speed-grade details and implementation guidance.

Request a quote or submit an inquiry to begin evaluating 5SGXEA5H2F35I3NCV for your next high-density FPGA design.