5SGXEA5H2F35I3G

The 5SGXEA5H2F35I3G is a Stratix V GX family Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It provides a high-logic-density, surface-mount FPGA solution with extensive on-chip memory and a large I/O count for demanding board-level designs.

With approximately 490,000 logic elements and roughly 46 Mbits of embedded RAM, this device targets industrial applications that require substantial programmable logic, large embedded memory, and a high number of I/Os while operating across an extended temperature range.

Key Features

• Core Logic  Approximately 490,000 logic elements to implement complex, high-density programmable logic designs.
• Embedded Memory  Approximately 46 Mbits of total on-chip RAM for buffering, data storage, and local memory-intensive functions.
• I/O Density  552 user I/Os to support wide, parallel interfacing and high-pin-count system integration.
• Package & Mounting  1152-BBGA (FCBGA) supplier package — 1152-FBGA (35×35) — suitable for surface-mount PCB assembly.
• Power  Core supply range of 820 mV to 880 mV for integration into regulated multi-rail power architectures.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for harsh-environment deployment.
• Compliance  RoHS-compliant to support lead-free manufacturing and regulatory alignment.

Typical Applications

• Industrial control and automation  Suited to systems that require industrial temperature operation (−40 °C to 100 °C) combined with high logic and I/O capacity.
• High-density I/O systems  Ideal for boards that need many external interfaces — 552 I/Os provide flexibility for wide parallel connections and complex front-end networking.
• Embedded memory–intensive designs  Designs that rely on significant on-chip RAM for buffering, real-time data handling, or local storage benefit from ~46 Mbits of embedded RAM.
• Surface-mount, board-level integration  The 1152-FBGA (35×35) package supports compact, high-density PCB layouts where a surface-mount FPGA is required.

Unique Advantages

• High programmable logic capacity: Approximately 490,000 logic elements enable complex custom logic and fine-grained hardware acceleration on a single device.
• Substantial on-chip memory: ~46 Mbits of embedded RAM reduces dependence on external memory for many buffering and processing tasks, simplifying BOM and board routing.
• Large I/O count: 552 I/Os provide broad interfacing capability for multi‑lane, multi-peripheral, and high-parallelism system designs.
• Industrial temperature rating: Rated from −40 °C to 100 °C for reliability in factory, field, and other temperature-challenging environments.
• Compact surface-mount package: The 1152-FBGA (35×35) package balances pin count and PCB area for dense, production-ready board layouts.
• RoHS compliant: Supports lead-free manufacturing processes and regulatory requirements.

Why Choose 5SGXEA5H2F35I3G?

The 5SGXEA5H2F35I3G brings together large programmable logic capacity, significant embedded RAM, and a high I/O count in an industrial-grade Stratix V GX FPGA package. This combination supports complex, memory- and I/O-intensive designs that must operate reliably across extended temperature ranges.

Engineers and procurement teams looking for a high-density, surface-mount FPGA for industrial systems will find this device well suited to scalable designs that demand integration, robust operating range, and a compact package footprint.

Request a quote or submit a sales inquiry to receive pricing, availability, and technical support for evaluating 5SGXEA5H2F35I3G for your design.