5SGXEA5H2F35I2L

The 5SGXEA5H2F35I2L is a Stratix® V GX field programmable gate array designed for high-density, industrial-grade embedded designs. It integrates a large programmable fabric with abundant on-chip memory and a high I/O count to support complex logic, memory-buffering, and I/O-centric systems.

Key value propositions include substantial logic capacity, approximately 46 Mbits of embedded memory, extensive I/O, and a rugged operating range—delivering a platform suited to demanding industrial and embedded applications.

Key Features

• High Logic Capacity  Approximately 490,000 logic elements provide the programmable resources required for large-scale logic implementations and complex state machines.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support data buffering, lookup tables, and local storage for high-throughput designs.
• Extensive I/O  552 I/O pins enable connectivity to multiple external devices, high-pin-count headers, or dense peripheral arrays.
• Power Supply Range  Rated voltage supply from 820 mV to 880 mV, enabling designs targeting the device’s specified supply window.
• Industrial Operating Range  Specified for operation from −40 °C to 100 °C, supporting deployment in industrial temperature environments.
• Package & Mounting  Available in a 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting simplifies board assembly for high-density designs.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial control and automation  Industrial-grade temperature rating and large logic capacity support control systems, PLC functions, and process automation where reliability across a wide temperature range matters.
• High-density embedded compute  Large logic resources and substantial on-chip RAM enable implementation of complex algorithms and data-paths within a single device.
• I/O-rich systems  With 552 I/Os, the device is well suited for applications requiring extensive peripheral interfaces, multi-channel data acquisition, or dense I/O aggregation.

Unique Advantages

• Large programmable fabric: The approximately 490,000 logic elements reduce the need for multi-device partitioning and simplify system-level integration.
• Significant embedded memory: Approximately 46 Mbits of on-chip RAM enable local buffering and reduce external memory dependence for many workloads.
• High I/O count: 552 I/O pins provide flexibility for connecting numerous peripherals, sensors, or interface banks without additional bridging logic.
• Industrial temperature support: Rated from −40 °C to 100 °C for robust performance in harsh environments.
• Compact, high-pin FCBGA package: The 1152-FBGA (35×35) supplier package supports high-density PCB layouts while maintaining a surface-mount assembly flow.
• Low-voltage operation: Supported voltage supply range of 820 mV–880 mV for designs targeting the device’s specified supply requirements.

Why Choose 5SGXEA5H2F35I2L?

The 5SGXEA5H2F35I2L combines a substantial programmable resource pool, significant embedded memory, and a very high I/O count in an industrial-temperature-rated, surface-mount FCBGA package. This combination makes it suitable for designers who need to consolidate complex logic, memory buffering, and extensive peripheral interfacing into a single FPGA device.

For development teams and procurement focused on long-term projects, the device’s industrial rating, RoHS compliance, and robust package options deliver a scalable and reliable platform that integrates into high-density board designs.

Request a quote or submit a purchase inquiry to our sales team to get pricing and availability for the 5SGXEA5H2F35I2L.