5SGXEA5H2F35C3N

The 5SGXEA5H2F35C3N is a Stratix V GX field programmable gate array (FPGA) from Intel, offered in a 1152-BBGA FCBGA package. It provides a high on-chip logic and memory capacity together with a large I/O count, packaged for surface-mount assembly.

Designed for commercial temperature deployments (0 °C to 85 °C) and RoHS-compliant, this device targets designs that require substantial programmable logic, embedded memory, and broad external interfacing while operating at a low core-voltage range (820 mV to 880 mV).

Key Features

• High logic capacity  Approximately 490,000 logic elements (cells) to support complex logic integration and large-scale programmable designs.
• Embedded memory  Approximately 46.08 Mbits of on-chip RAM for buffering, state storage, and data-path implementation.
• Extensive I/O  Up to 552 device I/Os to support multiple interfaces and dense external connectivity.
• Stratix V GX series device  Part of the Stratix V GX family; the series datasheet documents Stratix V GX transceiver and series-level electrical characteristics and speed-grade offerings.
• Low-voltage core  Core supply range of 820 mV to 880 mV to match low-voltage FPGA power domains.
• Package and mounting  1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for high-pin-count board designs.
• Commercial temperature grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• Environmental compliance  RoHS-compliant.

Typical Applications

• High-speed serial link designs  Leverage the Stratix V GX series capability for designs that implement transceiver-based serial links as described in the family datasheet.
• High-density logic and compute acceleration  Suitable for custom accelerators and processing functions that require large logic element counts and on-chip RAM.
• I/O-rich systems  Ideal for boards and modules that need a high number of external interfaces and signal connections.

Unique Advantages

• Large programmable fabric: Approximately 490,000 logic elements enable consolidation of complex functions into a single device.
• Substantial embedded memory: Approximately 46.08 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Broad connectivity: 552 I/Os simplify integration with multiple external peripherals and parallel interfaces.
• Low core-voltage support: 820–880 mV core supply range aligns with modern low-voltage FPGA power domains.
• Commercial-grade qualification: 0 °C to 85 °C operating range for standard commercial deployments.
• High-pin-count FCBGA package: 1152-ball FBGA (35×35) package supports dense routing and layout strategies on multi-layer PCBs.

Why Choose 5SGXEA5H2F35C3N?

The 5SGXEA5H2F35C3N combines a very large logic element count, sizeable embedded memory, and a high I/O footprint in a surface-mount 1152-BBGA package, making it well suited to commercial designs that consolidate complex logic and require extensive interfacing. Its inclusion in the Stratix V GX family aligns the device with series-level transceiver capabilities and electrical characteristics documented in the Stratix V device datasheet.

Choose this device for commercial FPGA designs that need high integration density, significant on-chip RAM, and a large number of I/Os, alongside the expected supply and temperature ranges for commercial deployments.

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