5SGXEA5H2F35C2LN

The 5SGXEA5H2F35C2LN is a Stratix V GX family FPGA offering a combination of large logic capacity, substantial embedded memory, and high I/O density in a compact 1152-BBGA FCBGA package. It is a commercial-grade, surface-mount device intended for designs that require hundreds of thousands of logic elements, abundant on-chip RAM, and extensive I/O connectivity.

Key on-device characteristics include 490,000 logic elements, approximately 46.08 Mbits of embedded memory, and 552 user I/O pins, with a core supply voltage range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — Provides 490,000 logic elements to implement large-scale digital designs and complex logic functions.
• Embedded Memory — Approximately 46.08 Mbits of on-chip RAM to support data buffering, lookup tables, and state storage.
• I/O Density — 552 user I/O pins for extensive interfacing to peripherals, memories, and high-pin-count systems.
• Package — 1152-BBGA FCBGA (supplier package: 1152-FBGA, 35×35) that consolidates high pin count in a compact footprint; surface-mount mounting type.
• Power — Core supply voltage specified between 820 mV and 880 mV for the device core domain.
• Operating Conditions — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• Complex digital systems — Implement large-scale logic designs where hundreds of thousands of logic elements and significant on-chip RAM are required.
• Data buffering and on-chip storage — Leverage approximately 46.08 Mbits of embedded memory for buffering, packet storage, and high-throughput data paths.
• High-density I/O interfacing — Use the 552 I/O pins to connect multiple external devices, memory interfaces, and system peripherals.
• Compact, high-pin-count platforms — Deploy in systems that need a dense BGA package (1152-BBGA, 35×35) while maintaining surface-mount assembly.

Unique Advantages

• Large logic fabric: 490,000 logic elements provide the capacity needed for complex state machines, custom datapaths, and parallel processing.
• Substantial on-chip RAM: Approximately 46.08 Mbits of embedded memory reduces external memory dependence for many buffering and scratchpad requirements.
• Extensive I/O: 552 I/O pins enable broad system connectivity and flexible interfacing to diverse peripherals and subsystems.
• Compact FCBGA packaging: The 1152-BBGA, 35×35 supplier package consolidates high pin count into a manufacturable surface-mount form factor.
• Low-voltage core operation: Core supply range of 820 mV–880 mV supports modern low-voltage FPGA core domains.
• Commercial-grade availability: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial environments.

Why Choose 5SGXEA5H2F35C2LN?

The 5SGXEA5H2F35C2LN is positioned for designs that demand a high logic element count, significant embedded RAM, and a large number of I/O in a single, compact FPGA package. Its combination of 490,000 logic elements, approximately 46.08 Mbits of on-chip memory, and 552 I/O pins makes it suitable for complex digital systems and high-density interfacing requirements within commercial temperature ranges.

Choosing this Stratix V GX device provides a scalable platform for advanced FPGA-based implementations where integration density, memory resources, and I/O flexibility are primary design drivers. The device's specified core voltage and package details support integration into standard board-level designs with surface-mount assembly processes.

Request a quote or submit an inquiry to discuss availability, pricing, and lead times for the 5SGXEA5H2F35C2LN Stratix V GX FPGA. Our team will respond with the information you need to evaluate this device for your project.