5SGXEA5H2F35C2L

The 5SGXEA5H2F35C2L is a Stratix® V GX family FPGA IC from Intel, designed for high-density, configurable digital logic implementations. It provides a large logic fabric and substantial embedded memory, making it suitable for designs that require significant on-chip resources and extensive I/O connectivity.

This commercial-grade device targets applications that benefit from dense logic integration, abundant on-chip RAM, and broad I/O capabilities while operating within a standard commercial temperature range.

Key Features

• Programmable Logic Capacity  Approximately 490,000 logic elements to implement complex custom logic, datapaths, and hardware acceleration blocks.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffers, look-up tables, and state storage directly within the FPGA fabric.
• I/O Density  552 user I/O pins to support wide parallel interfaces, multiple peripheral connections, and high-pin-count designs.
• Power and Core Supply  Core voltage supply range from 820 mV to 880 mV to align with Stratix V GX device core requirements.
• Package and Mounting  1152-BBGA (FCBGA) package, supplied as 1152-FBGA (35×35), with surface-mount mounting for compact, board-level integration.
• Operating Conditions  Commercial operating temperature range from 0 °C to 85 °C for standard commercial-environment deployments.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density custom logic  Implement complex state machines, datapaths, and protocol logic using the device’s approximately 490,000 logic elements.
• On-chip buffering and packet processing  Use the approximately 46 Mbits of embedded RAM for line-rate buffering, FIFOs, and packet or frame storage.
• Multi-interface systems  Leverage 552 I/Os to connect to numerous peripherals, parallel buses, or high-pin-count interfaces on a single board.

Unique Advantages

• High logic density: Enables integration of large-scale custom logic blocks and multiple functions on a single FPGA, reducing external component count.
• Substantial embedded memory: Approximately 46 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage needs.
• Extensive I/O: 552 I/O pins provide flexibility for complex board-level interfaces and parallel data paths.
• Compact FCBGA package: 1152-ball FCBGA (35×35) balances high pin count with a compact footprint for space-constrained boards.
• Commercial-grade operation: Rated for 0 °C to 85 °C, suitable for standard commercial electronic products and systems.
• RoHS compliant: Aligns with common environmental manufacturing requirements.

Why Choose 5SGXEA5H2F35C2L?

The 5SGXEA5H2F35C2L combines a large logic fabric, significant embedded memory, and extensive I/O in a compact FCBGA package, offering a balanced platform for dense, feature-rich FPGA designs. Its commercial-grade rating and RoHS compliance make it suitable for mainstream electronic products that require robust on-chip resources without industrial temperature specifications.

This part is well suited to teams and projects needing on-chip capacity for complex logic, sizeable internal buffering, and a high I/O count while maintaining standard commercial operating conditions and surface-mount board integration.

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