5SGXEA5H1F35I2N

The 5SGXEA5H1F35I2N is an Intel Stratix V GX field-programmable gate array (FPGA) in a 1152-FBGA (35×35) surface-mount package. It delivers high-density programmable logic with 490,000 logic elements and approximately 46 Mbits of embedded memory, plus a broad 552-pin I/O count for complex system integration.

Designed for industrial-grade applications, this device supports a wide operating temperature range and low core-voltage operation, making it suitable for dense, high-capacity designs that require significant on-chip memory and extensive I/O connectivity.

Key Features

• High-density logic — 490,000 logic elements provide large-capacity programmable fabric for complex digital designs.
• Embedded memory — Approximately 46 Mbits of on-chip RAM to support buffering, packet processing, and memory-intensive acceleration functions.
• Rich I/O — 552 device I/O pins to interface with multiple peripherals, high-speed interfaces, and large FPGA-to-FPGA or FPGA-to-SoC connectivity.
• Package and mounting — 1152-FBGA (35×35) package in a surface-mount form factor for board-level integration where a high-pin-count BGA is required.
• Core voltage — Operates at a core supply range of 870 mV to 930 mV for defined power domains and system power planning.
• Industrial temperature grade — Rated for operation from –40°C to 100°C, suitable for industrial environments and extended-temperature applications.
• RoHS compliant — Conforms to RoHS environmental requirements for lead-free manufacturing.

Typical Applications

• Industrial control and automation — High logic density and extensive I/O make this device suitable for programmable controllers, motion control, and complex signal processing in industrial systems.
• High-bandwidth data handling — Large on-chip RAM and many I/O pins support buffering and routing tasks in data aggregation, packet processing, and memory-intensive accelerators.
• Prototyping and custom logic — The programmable fabric and substantial logic element count allow implementation of large custom hardware blocks, algorithm acceleration, and system prototyping.

Unique Advantages

• Large programmable capacity: 490,000 logic elements enable implementation of complex, multi-function designs without immediate need for external logic expansion.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage tasks, simplifying board-level BOM.
• Extensive I/O connectivity: 552 I/O pins provide flexibility for interfacing to numerous peripherals and parallel interfaces, improving system integration options.
• Industrial temperature support: Rated from –40°C to 100°C to meet demanding environmental requirements common in industrial deployments.
• Compact BGA package: 1152-FBGA (35×35) offers a high pin count in a space-efficient form factor for dense PCB layouts.
• Defined core voltage range: 870 mV to 930 mV operation facilitates predictable power sequencing and design of power delivery networks.

Why Choose 5SGXEA5H1F35I2N?

The 5SGXEA5H1F35I2N positions itself as a high-capacity, industrial-grade FPGA option where large programmable logic resources, substantial embedded memory, and extensive I/O count are required. Its combination of nearly half a million logic elements and approximately 46 Mbits of on-chip RAM supports designs that demand on-device storage and complex logic implementations while the broad operating temperature range addresses harsher deployment environments.

This device is well suited for engineers and teams building dense, reconfigurable systems—where integration, memory capacity, and I/O flexibility reduce external components and simplify board-level design. The RoHS compliance and BGA packaging further support modern manufacturing and compact PCB architectures.

Request a quote or submit an inquiry to get pricing and availability for the 5SGXEA5H1F35I2N and discuss how it can fit into your next high-density FPGA design.