5SGXEA5H2F35C1N

The 5SGXEA5H2F35C1N is a Stratix V GX field programmable gate array (FPGA) IC from Intel, configured in a 1152‑ball BGA (FCBGA) package. This device delivers a high density of programmable logic and embedded memory for complex, board‑level programmable logic applications.

With 490,000 logic elements and approximately 46.08 Mbits of on‑chip RAM, the device targets designs that require large logic capacity, substantial embedded memory, and a high I/O count in a compact surface‑mount package.

Key Features

• Core Logic  490,000 logic elements provide substantial programmable fabric for complex logic and custom compute functions.
• Logic Array Blocks  185,000 LABs (logic array blocks) for structured logic partitioning and resource organization.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM to support large buffering, state storage, and memory‑intensive IP.
• I/O Capacity  552 I/O pins to support high‑pin‑count interfacing and multiple parallel interfaces on a single device.
• Power and Operating Range  Core supply range 870 mV to 930 mV; designed for commercial‑grade systems with an operating temperature of 0 °C to 85 °C.
• Package and Mounting  1152‑BBGA FCBGA package (supplier package: 1152‑FBGA, 35×35) with surface‑mount mounting type for compact board integration.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density programmable logic  Use the large logic element count for implementation of complex state machines, datapaths, and custom accelerators.
• Memory‑intensive designs  On‑chip RAM enables buffering, packet queues, and mid‑level cache implementations without immediate external memory dependence.
• High I/O systems  552 I/Os accommodate multi‑lane interfaces, wide parallel buses, and mixed signal board topologies requiring many external connections.
• Compact board integration  The 1152‑BBGA (35×35) surface‑mount package supports space‑constrained PCBs while maintaining high pin count.

Unique Advantages

• High logic capacity: 490,000 logic elements allow implementation of large, integrated FPGA designs without immediate partitioning across devices.
• Substantial on‑chip RAM: Approximately 46.08 Mbits of embedded memory reduces dependence on external memory for many buffering and working‑storage needs.
• Extensive I/O: 552 I/O pins enable flexible system interfaces and high‑throughput board connectivity.
• Compact high‑pin package: 1152‑BBGA (35×35) packaging provides a high pin density in a surface‑mount form factor suitable for modern PCB layouts.
• Commercial temperature and compliance: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial product deployments.

Why Choose 5SGXEA5H2F35C1N?

The 5SGXEA5H2F35C1N delivers a combination of high logic density, significant embedded memory, and a large I/O count in a compact 1152‑ball BGA package, making it well suited for engineers building complex, memory‑heavy FPGA systems that require many external interfaces. As a commercial‑grade Stratix V GX device from Intel, it fits designs that prioritize integration density and on‑chip resource capacity within the specified 0 °C to 85 °C operating window.

Request a quote or submit an inquiry for availability and pricing to evaluate the 5SGXEA5H2F35C1N for your next programmable logic design.