5SGXEA5H2F35C1G

The 5SGXEA5H2F35C1G is a Stratix V GX field programmable gate array (FPGA) in a high-density FCBGA package. It provides a large logic capacity and substantial on-chip memory for complex, custom digital designs.

Designed for applications that require high logic element counts, significant embedded RAM, and extensive I/O, this commercial-grade device balances performance and integration with a low-voltage core operating range and RoHS compliance.

Key Features

• Core Logic — 490,000 logic elements suitable for large-scale custom logic implementations and complex combinational/sequential designs.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM to support buffering, large state machines, and memory-intensive algorithms.
• I/O Density — 552 user I/O pins to support multiple high-pin-count interfaces and board-level integration.
• Package & Mounting — 1152-FBGA (35×35) package case in a surface-mount FCBGA form factor for high-density PCB assembly.
• Power — Core voltage supply range of 870 mV to 930 mV, enabling low-voltage operation for the device core.
• Grade & Temperature — Commercial grade with an operating temperature range of 0°C to 85°C.
• Regulatory — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-density signal processing — Large logic capacity and on-chip RAM support complex DSP pipelines and custom data-path implementations.
• High-pin-count interface hubs — 552 I/O enable aggregation and bridging of multiple board-level interfaces and peripherals.
• Compute acceleration and prototyping — Substantial logic and memory resources make it suitable for hardware acceleration prototypes and large custom accelerators.
• Complex control systems — Ample logic elements and embedded RAM allow implementation of advanced control algorithms and state-machine intensive designs.

Unique Advantages

• High logic density: 490,000 logic elements provide extensive capacity for integrating large amounts of bespoke logic on a single device.
• Significant embedded memory: Approximately 46 Mbits of on-chip RAM reduce dependency on external memory for many buffering and state-storage needs.
• Extensive I/O: 552 user I/O pins simplify system integration where multiple interfaces or parallel connections are required.
• Compact, high-pin-count package: The 1152-FBGA (35×35) FCBGA package supports dense PCB layouts while maintaining broad routing capability.
• Low-voltage core operation: Core supply range of 870–930 mV supports designs optimized for lower-power core operation.
• Commercial readiness: Rated for 0°C to 85°C operation and RoHS compliant for mainstream commercial products.

Why Choose 5SGXEA5H2F35C1G?

This Stratix V GX device is positioned for designs that need a combination of very high logic capacity, substantial embedded RAM, and a large number of I/O signals in a compact FCBGA package. Its electrical characteristics and package make it suitable for complex FPGA-based systems where integration density and on-chip memory are key design drivers.

For engineering teams and procurement looking to scale prototypes into production-ready commercial designs, the 5SGXEA5H2F35C1G offers a balance of integration, thermal-operating range, and regulatory compliance that supports long-term design stability and supply-chain compatibility.

Request a quote or submit an inquiry for pricing and availability of the 5SGXEA5H2F35C1G to evaluate it for your next high-density FPGA design.