5SGXEA5H1F35C2LN

The 5SGXEA5H1F35C2LN is a Stratix V GX family Field Programmable Gate Array (FPGA) supplied in a 1152‑ball BGA (FCBGA) package. This commercial‑grade device delivers very high logic density and on‑chip memory capacity for demanding programmable logic designs.

With 490,000 logic elements, approximately 46.08 Mbits of embedded memory and 552 I/O pins, this device is suited to high‑density digital systems where integration, I/O count and on‑chip RAM are key design drivers. The device operates from a core supply of 820 mV to 880 mV and is rated for 0 °C to 85 °C operating temperature.

Key Features

• High Logic Density  Approximately 490,000 logic elements to implement large, complex digital functions and custom accelerators.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM to support buffering, state machines, and memory‑intensive algorithms.
• High I/O Count  552 I/O pins provide extensive external connectivity for parallel interfaces, control signals and high‑speed peripherals.
• Power and Core Supply  Core voltage supply range of 820 mV to 880 mV to match system power architectures.
• Package & Mounting  1152‑BBGA (supplier package: 1152‑FBGA, 35×35) in a surface‑mount FCBGA format for dense board integration.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for commercial applications.
• Standards Compliance  RoHS compliant, meeting common environmental and materials requirements.
• Stratix V GX Family Characteristics  Part of the Stratix V GX series; family documentation details electrical characteristics, I/O timing and high‑speed transceiver options for system design.

Typical Applications

• Network & Communications Equipment  High logic density and extensive I/O make this device suitable for packet processing, line cards and protocol bridging where on‑chip logic and memory reduce external component count.
• High‑Performance Data Processing  Large embedded memory and abundant logic elements support data buffering and parallel computation tasks in acceleration and signal processing modules.
• Platform Prototyping and Emulation  Use as a high‑capacity programmable fabric for system prototyping, IP integration and hardware validation before ASIC implementation.

Unique Advantages

• High integration density: 490,000 logic elements and substantial on‑chip RAM reduce the need for external logic and memory, simplifying board design.
• Extensive external connectivity: 552 I/O pins support complex multi‑lane interfaces, sensors, and peripherals without extensive I/O multiplexing.
• Commercial readiness: Rated for 0 °C to 85 °C and supplied in a compact 1152‑ball FCBGA package for high‑density surface‑mount assemblies.
• Controlled core power domain: Narrow core voltage range (820 mV–880 mV) facilitates predictable power budgeting and thermal planning.
• RoHS compliant: Meets common environmental requirements for electronics manufacturing and deployment.
• Family documentation available: Stratix V device documentation provides electrical, switching and I/O timing details to support system integration and validation.

Why Choose 5SGXEA5H1F35C2LN?

The 5SGXEA5H1F35C2LN positions itself as a high‑density, commercially rated Stratix V GX FPGA optimized for designs that require significant logic resources, large embedded memory and a high number of I/O signals. Its 1152‑ball FCBGA package and surface‑mount mounting enable compact board layouts while maintaining extensive connectivity.

Choose this device when you need a proven Stratix V GX family FPGA for complex digital systems, data and signal processing, or platform prototyping where on‑chip resources and a predictable power envelope are critical. Manufacturer documentation for the Stratix V family provides the electrical and timing parameters needed for system design and verification.

Request a quote or submit an inquiry to obtain pricing, availability and ordering information for the 5SGXEA5H1F35C2LN. Our team can provide the next steps for procurement and delivery.