5SGXEA5H1F35C1N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 69 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXEA5H1F35C1N – Stratix® V GX Field Programmable Gate Array (FPGA)
The 5SGXEA5H1F35C1N is a Stratix® V GX field programmable gate array (FPGA) manufactured by Intel. It delivers a high-capacity programmable fabric with approximately 490,000 logic elements and approximately 46 Mbits of embedded memory for complex digital designs.
Designed as a surface-mount FCBGA device in a 1152-ball package, this commercial-grade FPGA provides a large I/O count and low core voltage operation for space-efficient, high-density system integration.
Key Features
- Logic Capacity Approximately 490,000 logic elements to implement large-scale digital designs and custom datapaths.
- Embedded Memory Approximately 46 Mbits of on-chip RAM for buffering, packet memory, and intermediate storage within the FPGA fabric.
- I/O Resources 552 user I/Os to support extensive external interfacing and high-pin-count system requirements.
- Power and Core Voltage Core supply range specified at 870 mV to 930 mV to meet device power requirements and system power-rail design.
- Package & Mounting 1152-BBGA (1152-FBGA, 35×35) package; surface-mount FCBGA format for compact board-level integration.
- Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Standards Compliance RoHS compliant.
Unique Advantages
- High integration density: Large logic element count and substantial embedded memory reduce external components and simplify multi-function designs.
- Extensive I/O capability: 552 I/Os enable broad interfacing options for high-pin-count systems and complex board routing.
- Compact package: 1152-ball FCBGA package supports high-density PCB layouts while maintaining robust electrical connections.
- Predictable power envelope: Specified core voltage range (870–930 mV) helps streamline power-rail design and system BOM planning.
- Commercial-grade availability: Supplied in a commercial temperature grade suitable for a wide range of standard embedded and communications applications.
Why Choose 5SGXEA5H1F35C1N?
The 5SGXEA5H1F35C1N positions itself for designs that require a high-density programmable fabric with ample on-chip memory and a large number of I/Os. Its combination of approximately 490,000 logic elements, roughly 46 Mbits of embedded RAM, and 552 I/Os supports complex digital systems while enabling consolidated designs that reduce external component count.
Delivered in a 1152-ball FCBGA surface-mount package and compliant with RoHS, this Stratix V GX device is suitable for commercial-grade projects that demand significant integration, predictable power requirements, and a compact board footprint. Detailed electrical and switching characteristics are documented in the Stratix V device datasheet for design verification and system integration.
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