5SGXEA5H1F35C1N

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 46080000 490000 1152-BBGA, FCBGA

Quantity 69 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5H1F35C1N – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXEA5H1F35C1N is a Stratix® V GX field programmable gate array (FPGA) manufactured by Intel. It delivers a high-capacity programmable fabric with approximately 490,000 logic elements and approximately 46 Mbits of embedded memory for complex digital designs.

Designed as a surface-mount FCBGA device in a 1152-ball package, this commercial-grade FPGA provides a large I/O count and low core voltage operation for space-efficient, high-density system integration.

Key Features

  • Logic Capacity  Approximately 490,000 logic elements to implement large-scale digital designs and custom datapaths.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, packet memory, and intermediate storage within the FPGA fabric.
  • I/O Resources  552 user I/Os to support extensive external interfacing and high-pin-count system requirements.
  • Power and Core Voltage  Core supply range specified at 870 mV to 930 mV to meet device power requirements and system power-rail design.
  • Package & Mounting  1152-BBGA (1152-FBGA, 35×35) package; surface-mount FCBGA format for compact board-level integration.
  • Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Standards Compliance  RoHS compliant.

Unique Advantages

  • High integration density: Large logic element count and substantial embedded memory reduce external components and simplify multi-function designs.
  • Extensive I/O capability: 552 I/Os enable broad interfacing options for high-pin-count systems and complex board routing.
  • Compact package: 1152-ball FCBGA package supports high-density PCB layouts while maintaining robust electrical connections.
  • Predictable power envelope: Specified core voltage range (870–930 mV) helps streamline power-rail design and system BOM planning.
  • Commercial-grade availability: Supplied in a commercial temperature grade suitable for a wide range of standard embedded and communications applications.

Why Choose 5SGXEA5H1F35C1N?

The 5SGXEA5H1F35C1N positions itself for designs that require a high-density programmable fabric with ample on-chip memory and a large number of I/Os. Its combination of approximately 490,000 logic elements, roughly 46 Mbits of embedded RAM, and 552 I/Os supports complex digital systems while enabling consolidated designs that reduce external component count.

Delivered in a 1152-ball FCBGA surface-mount package and compliant with RoHS, this Stratix V GX device is suitable for commercial-grade projects that demand significant integration, predictable power requirements, and a compact board footprint. Detailed electrical and switching characteristics are documented in the Stratix V device datasheet for design verification and system integration.

If you would like pricing, availability, or to request a quote for part number 5SGXEA5H1F35C1N, please submit your inquiry and we will respond with the requested information.

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