5SGXEA5H1F35C2LG

The 5SGXEA5H1F35C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152‑BBGA (FCBGA) package. It delivers high logic density, substantial on‑chip memory, and a large I/O count for demanding programmable-logic designs.

With approximately 490,000 logic elements, roughly 46 Mbits of embedded memory, and 552 I/O pins, this commercial‑grade device targets high‑density programmable logic, high‑I/O and high‑memory designs that require integrated, configurable logic resources. As a member of the Stratix V GX family, the series includes devices with high‑speed transceiver speed grades documented in the device datasheet.

Key Features

• Logic Capacity  Approximately 490,000 logic elements to implement complex, high‑density logic and control functions.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM for buffering, packet processing, and intermediate storage.
• I/O  552 general-purpose I/O pins to support wide external interfaces, parallel buses, and mixed I/O requirements.
• Package and Mounting  1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface‑mount mounting type.
• Power  Core voltage supply specified at 820 mV to 880 mV to match system power‑rail design constraints.
• Commercial Grade Temperature  Operating temperature range 0 °C to 85 °C for commercial applications.
• RoHS Compliant  Device is RoHS compliant.
• Stratix V GX Family Transceiver Options  The Stratix V GX family (as documented in the device datasheet) offers GX channel transceiver speed grades in the family specification, enabling high‑speed serial connectivity options within the series.

Typical Applications

• High‑density programmable logic  Implement large-scale custom logic, protocol engines, and control systems where high logic element counts and on‑chip RAM are required.
• Network and communications infrastructure  Support for high I/O counts and family transceiver options make this device suitable for packet processing, protocol bridging, and interface aggregation tasks.
• Compute acceleration and signal processing  Substantial logic and embedded memory resources allow creation of hardware accelerators and streaming data pipelines.

Unique Advantages

• High integration density:  Large logic element count and significant embedded RAM reduce the need for external logic and memory components.
• Extensive I/O capability:  552 I/O pins provide flexibility for multi‑lane interfaces, wide data buses, and mixed‑signal front ends.
• Commercial temperature qualification:  Specified 0 °C to 85 °C operating range for standard commercial applications and deployments.
• Compact, surface‑mount package:  1152‑BBGA (FCBGA) package supports dense board integration and modern assembly processes.
• Power‑rail alignment:  Defined core voltage range (820–880 mV) supports precise power budgeting and efficient core operation.
• Regulatory compliance:  RoHS compliance simplifies environmental compliance for manufactured products.

Why Choose 5SGXEA5H1F35C2LG?

The 5SGXEA5H1F35C2LG provides a compelling combination of high logic capacity, substantial embedded memory, and large I/O count in a compact FCBGA package. Its specifications make it appropriate for designers building high‑density programmable solutions where on‑chip resources and I/O flexibility are critical.

This commercially graded Stratix V GX device is suitable for development teams and product designs that require scalable logic resources, integrated memory for data handling, and documented family options for high‑speed transceivers. The device’s clear electrical parameters and package information support reliable system integration and long‑term design planning.

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