5SGXEA5H1F35C2L

The 5SGXEA5H1F35C2L is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1152-ball FCBGA package. It provides large programmable logic capacity, substantial on-chip RAM, and a high I/O count for designs that require dense logic integration and robust I/O routing.

This commercial-grade device is targeted at applications that need significant logic resources and embedded memory while operating within a 0 °C to 85 °C range and a low-voltage core supply of 820 mV to 880 mV.

Key Features

• Logic Capacity — 490,000 logic elements for implementing large-scale digital designs and complex logic functions.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Resources — 552 user I/O pins to accommodate extensive peripheral interfaces, bus connections, and board-level signal routing.
• Package and Mounting — 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35) and surface-mount mounting for board-level integration.
• Power and Voltage — Core voltage supply range of 820 mV to 880 mV for low-voltage operation.
• Operating Conditions & Grade — Commercial temperature grade with an operating range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Complex digital systems — Use the large logic element count to implement extensive custom logic, datapaths, and control functions.
• High-density I/O interfacing — Leverage 552 I/Os for multi-channel I/O, board-level interconnects, and mixed-signal front-end routing.
• Memory-reliant designs — Utilize approximately 46 Mbits of embedded RAM for buffering, packet storage, and algorithmic state retention.
• Prototyping and system integration — Ideal for engineering prototypes and designs that require significant on-chip resources in a single FPGA package.

Unique Advantages

• High programmable density: 490,000 logic elements enable consolidation of complex functions into one device, reducing board-level component count.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM minimizes dependence on external memory for many designs, simplifying layout and BOM.
• Extensive I/O capability: 552 I/Os provide flexibility for interfacing to multiple peripherals, buses, and mezzanine connectors.
• Compact BGA footprint: 1152-ball FCBGA package (35×35) supports high-density PCB layouts while maintaining serviceable pin count.
• Low-voltage core operation: Core supply range of 820 mV–880 mV supports power-optimized system architectures.
• Commercial-grade and RoHS compliant: Designed for commercial temperature operation (0 °C–85 °C) and meets RoHS requirements for regulatory compliance.

Why Choose 5SGXEA5H1F35C2L?

The 5SGXEA5H1F35C2L delivers a balance of large programmable logic, ample embedded memory, and abundant I/O in a surface-mount 1152-BBGA package. Its specification set targets designs that require consolidation of complex logic and substantial on-chip buffering while operating at a low-voltage core and within commercial temperature limits.

This device is well suited to engineering teams and system integrators who need a high-capacity FPGA for dense digital designs, extensive I/O requirements, and reduced external memory dependence—providing scalability and integration for medium- to high-complexity projects.

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