5SGXEA5H1F35C2N

The 5SGXEA5H1F35C2N is a Stratix V GX FPGA from Intel, presented in a 1152‑BBGA (1152‑FBGA, 35×35) surface‑mount package. It provides a large programmable fabric — 490,000 logic elements — and approximately 46.08 Mbits of embedded memory, making it suitable for designs that require significant on‑chip logic capacity and memory.

With 552 user I/Os, a commercial temperature grade (0 °C to 85 °C), and a core supply window of 870 mV to 930 mV, this device targets complex digital and system‑level applications that demand high I/O density and large logic/memory integration.

Key Features

• Core Logic — 490,000 logic elements to implement large, complex digital designs and custom hardware acceleration.
• Embedded Memory — Approximately 46.08 Mbits of on‑chip RAM for buffers, FIFOs, and embedded storage without external memory dependence.
• I/O Density — 552 user I/Os to support high‑pin‑count interfaces and multi‑lane connectivity within a single FPGA package.
• Package & Mounting — 1152‑BBGA (supplier package: 1152‑FBGA, 35×35) in a surface‑mount form factor for compact board integration.
• Power Supply — Core supply range 870 mV to 930 mV to match system power rails and enable predictable operating conditions.
• Temperature & Grade — Commercial grade with an operating range of 0 °C to 85 °C for standard commercial applications.
• Standards Compliance — RoHS compliant to support lead‑free manufacturing requirements.
• Family Transceiver Options — Stratix V GX family devices support GX transceiver speed grades (series documentation lists GX channel options up to 14.1 Gbps for applicable speed grades), allowing selection of parts tailored to required serial link performance.

Typical Applications

• High‑density digital processing — Implement large finite state machines, datapaths, and hardware accelerators using the substantial logic and embedded memory resources.
• Multi‑interface bridging — Consolidate multiple high‑pin‑count interfaces into a single device leveraging 552 I/Os for protocol translation and glue logic.
• Embedded system control — Integrate complex control, timing, and custom peripheral logic for commercial embedded products within the 0 °C to 85 °C operating range.
• High‑speed serial links (family capability) — Where applicable within the Stratix V GX family, deploy GX transceiver speed grades to support high‑bandwidth serial channels (refer to family documentation for available speed grades).

Unique Advantages

• Large on‑chip capacity: 490,000 logic elements and ~46.08 Mbits of embedded RAM reduce reliance on external logic and memory, simplifying board design.
• High I/O count: 552 I/Os enable integration of multiple peripherals and parallel interfaces without external multiplexing.
• Compact, manufacturable package: 1152‑FBGA (35×35) surface‑mount package balances density and assembly for commercial production.
• Predictable power envelope: Controlled core supply range (870–930 mV) supports stable power budgeting and thermal planning.
• Commercial temperature suitability: Rated 0 °C to 85 °C for a wide range of standard commercial applications.
• RoHS compliant: Supports lead‑free processes and regulatory requirements for commercial electronics manufacturing.

Why Choose 5SGXEA5H1F35C2N?

The 5SGXEA5H1F35C2N brings substantial programmable resources and high I/O density in a single commercial‑grade Stratix V GX FPGA package. Its combination of 490,000 logic elements, approximately 46.08 Mbits of embedded memory, and 552 I/Os positions it for complex, integration‑heavy designs where on‑chip capacity and interface count matter.

Manufactured by Intel and supported by Stratix V family documentation, this device is appropriate for engineering teams building advanced commercial systems that require scalable logic capacity, significant embedded memory, and flexible I/O in a compact BGA package.

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