5SGXEA5H1F35I2G

The 5SGXEA5H1F35I2G is a Stratix V GX field programmable gate array (FPGA) in an industrial-grade, surface-mount FCBGA package. It delivers high logic density and substantial on‑chip memory to support complex, resource-intensive digital designs.

Designed for applications that require large logic capacity, abundant embedded RAM, and a high I/O count, this device combines 490,000 logic elements with approximately 46 Mbits of embedded memory and up to 552 I/Os in a 1152‑ball BGA (35×35 mm) package.

Key Features

• Core Logic  490,000 logic elements for implementing large-scale custom logic, control and datapath functions.
• On‑Chip Memory  Approximately 46 Mbits of embedded memory to support buffering, packet processing, and DSP data storage.
• I/O Density  Up to 552 user I/Os to interface with high‑pin‑count systems and multiple peripheral domains.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA, 35×35 mm) optimized for surface‑mount PCB assembly and high pin‑count routing.
• Power Supply Range  Voltage supply range 870 mV to 930 mV, enabling predictable core power design and margining.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Manufactured in accordance with RoHS requirements.
• Series‑Level Transceiver Options  Part of the Stratix V GX family; series documentation references transceiver speed grade options for high‑speed serial interfaces (see series datasheet for details).

Typical Applications

• High‑density digital systems  Large logic capacity and abundant embedded RAM enable complex protocol engines, custom accelerators, and multi‑function SoC replacements.
• Networking & Telecom  High I/O count and Stratix V GX family transceiver options support demanding packet processing and line‑rate interface implementations.
• Signal Processing & DSP  Substantial logic and memory resources are suited for real‑time DSP, filtering, and algorithm acceleration.
• Industrial & Embedded Control  Industrial temperature rating and surface‑mount BGA packaging make the device suitable for ruggedized control and automation systems.

Unique Advantages

• High logic density: 490,000 logic elements allow consolidation of multiple functions into a single device, reducing system complexity and BOM count.
• Large embedded memory: Approximately 46 Mbits of on‑chip RAM supports large buffers and state storage without external memory overhead.
• Extensive I/O: 552 I/Os provide flexibility to connect numerous peripherals, high‑speed interfaces, and multi‑bank signaling schemes.
• Industrial robustness: −40 °C to 100 °C operating range enables deployment in demanding industrial environments.
• Compact, high‑pin package: 1152‑BBGA (35×35 mm) FCBGA package balances high I/O count with a compact footprint for dense PCB layouts.
• Standards compliance: RoHS compliance supports environmentally responsible designs and manufacturing.

Why Choose 5SGXEA5H1F35I2G?

The 5SGXEA5H1F35I2G positions itself as a high‑capacity, industrial‑grade FPGA for designs that demand substantial logic and memory resources along with a large I/O complement. Its combination of 490,000 logic elements, approximately 46 Mbits of embedded RAM, and up to 552 I/Os in a 1152‑ball FCBGA package supports integration of complex processing, buffering, and interfacing within a single device.

Engineers and system designers targeting high‑performance networking, signal processing, or industrial control applications will find this device offers the scalability and rugged operating range required for production deployments, backed by the Stratix V series documentation and device family support.

Request a quote or contact sales to discuss availability, pricing, and how the 5SGXEA5H1F35I2G can fit your next high‑density FPGA design.