5SGXEA5H2F35C3G

The 5SGXEA5H2F35C3G is a Stratix V GX field programmable gate array (FPGA) in a 1152-ball FCBGA package. It delivers high logic density, extensive I/O, and substantial on-chip memory for designs that require large-scale programmable logic integration.

With 490,000 logic elements and approximately 46.08 Mbits of embedded memory, this commercial-grade device targets applications that need high-capacity programmable logic, large I/O counts (552 pins), and a compact surface-mount footprint.

Key Features

• Core Logic  Approximately 490,000 logic elements for large-scale programmable logic integration and complex design mapping.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support deep buffers, large state machines, or local data storage.
• High I/O Count  552 I/O pins to support multi-channel interfacing and dense system connectivity.
• Package & Mounting  1152-ball FCBGA package (35×35) optimized for surface-mount PCB assembly and compact system designs.
• Power  Core supply range specified at 820 mV to 880 mV, enabling operation within a defined low-voltage core window for predictable power budgeting.
• Operating Grade & Temperature  Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• Environmental Compliance  RoHS-compliant for regulatory and manufacturing alignment.

Typical Applications

• High-density FPGA designs  Large-scale logic and embedded memory make this device suitable for designs that consolidate multiple functions into a single programmable device.
• Data buffering and local storage  Approximately 46 Mbits of on-chip RAM supports buffering, packet handling, and intermediate data storage within high-throughput systems.
• Multi-channel interfacing  A 552-pin I/O count enables dense front-end or back-end connectivity for systems requiring many parallel interfaces.

Unique Advantages

• High logic capacity: The large logic-element count enables implementation of complex algorithms and system-level integration on a single device.
• Significant embedded memory: Nearly 46 Mbits of RAM reduces reliance on external memory for many buffering and stateful functions.
• Extensive I/O: 552 I/O pins provide flexible interfacing options for multi-channel designs and board-level consolidation.
• Compact FCBGA package: The 1152-ball (35×35) FCBGA package offers high density in a surface-mount form factor for space-constrained PCBs.
• Defined low-voltage core: 820–880 mV core supply range simplifies power delivery planning and core power budgeting.
• RoHS compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose 5SGXEA5H2F35C3G?

The 5SGXEA5H2F35C3G combines high logic density, substantial on-chip RAM, and a large I/O complement in a compact FCBGA package, making it well suited for projects that require significant programmable logic integration and dense interfacing. As a Commercial-grade member of the Stratix V GX family, its electrical and switching characteristics are defined in the Stratix V device documentation to support system-level planning.

Choose this FPGA when you need a single-device solution to consolidate complex logic, local memory, and many external interfaces while maintaining a predictable core-voltage and temperature operating window.

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