5SGXEA5K2F40I3LN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA

Quantity 166 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5K2F40I3LN – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXEA5K2F40I3LN is a Stratix® V GX family FPGA IC from Intel, offering very high logic density and extensive I/O for demanding programmable-logic designs. It integrates approximately 490,000 logic elements and approximately 46.08 Mbits of embedded memory, making it suitable for high-channel-count and high-bandwidth applications that require large on-chip resources and flexible I/O.

Packaged in a 1517-ball FCBGA (1517-FBGA, 40×40) with surface-mount mounting and rated for industrial temperatures, this device is specified for a core voltage supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

  • High Logic Density — Approximately 490,000 logic elements and 185,000 logic blocks provide large programmable fabric for complex algorithms and multi-function designs.
  • Embedded Memory — Approximately 46.08 Mbits of on-chip RAM to support large buffers, lookup tables, and state storage without external memory.
  • Extensive I/O — Up to 696 user I/Os to interface with multiple high-pin-count peripherals, parallel buses, and multi-lane interfaces.
  • Transceiver Capability (Series) — Stratix V GX devices include transceiver speed grades documented up to 14.1 Gbps (series-level specification), enabling high-speed serial link designs when using the appropriate transceiver grade.
  • Power and Core Supply — Core voltage supply specified from 820 mV to 880 mV for predictable power planning and power-delivery design.
  • Industrial Temperature Grade — Specified operating range from −40 °C to 100 °C for deployment in industrial environments.
  • Package and Mounting — 1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) with surface-mount mounting for compact PCB integration.
  • RoHS Compliant — Meets RoHS requirements for lead-free manufacturing and regulatory compliance.

Typical Applications

  • High‑speed communications — Leverage the Stratix V GX transceiver speed grades and large logic/memory resources for packet processing, line cards, and multi-gigabit serial links.
  • Networking and data center — Implement complex packet engines, protocol offloads, and high‑density switching functions using the device’s extensive I/O and on‑chip memory.
  • Compute acceleration — Deploy as a hardware accelerator for dataflow, DSP, or custom compute pipelines requiring large logic capacity and embedded memory.
  • Industrial systems — Use the industrial temperature grade and high I/O count for control systems, test equipment, and instrumentation that require robust operation across −40 °C to 100 °C.

Unique Advantages

  • Large programmable fabric: Enables consolidation of multiple subsystems into a single FPGA, reducing board-level complexity and BOM.
  • Substantial on-chip RAM: Approximately 46.08 Mbits of embedded memory reduces reliance on external memory and improves data locality and throughput.
  • High I/O count: 696 user I/Os simplify interfacing to multi-channel front ends, wide parallel buses, and dense connector systems.
  • Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in harsher environments without additional qualification statements.
  • Well-defined power window: Core supply range of 820 mV–880 mV assists predictable power-supply design and thermal planning.
  • RoHS compliance: Facilitates integration into modern, lead‑free production flows.

Why Choose 5SGXEA5K2F40I3LN?

The 5SGXEA5K2F40I3LN places a large Stratix V GX FPGA fabric, substantial embedded memory, and a very high I/O count into a compact 1517‑ball FCBGA package rated for industrial temperatures. It is suited for system designs that require high logic capacity, extensive connectivity, and on‑chip memory to implement complex, high-throughput functions while maintaining predictable power and thermal parameters.

Its specification makes it a practical choice for engineering teams building high-speed communications systems, networking equipment, compute accelerators, and industrial platforms that require scalable programmable logic and a robust component footprint from a recognized FPGA family.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEA5K2F40I3LN.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up