5SGXEA5K3F35C2L

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA

Quantity 199 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5K3F35C2L – Stratix® V GX Field Programmable Gate Array (FPGA), 1152‑BBGA

The 5SGXEA5K3F35C2L is a commercial‑grade Stratix V GX Field Programmable Gate Array from Intel, delivering high programmable logic capacity and on‑chip memory for complex designs. It targets high‑density programmable logic applications that require large logic resources, substantial embedded RAM, and a high count of user I/O in a compact FCBGA package.

The device is specified with a defined core voltage range and an industry standard commercial operating temperature, and it is covered by the Stratix V device datasheet for electrical and switching characteristics.

Key Features

  • High logic capacity Approximately 490,000 logic elements, enabling large, complex logic implementations on a single device.
  • Embedded memory Approximately 46 Mbits of on‑chip RAM (46,080,000 bits) to support data buffering, state storage, and memory‑intensive logic functions.
  • Extensive I/O 432 user I/O pins to support wide bus interfaces and multiple external peripherals without additional I/O expanders.
  • Core voltage range Operates from 820 mV to 880 mV, providing the defined supply window required for device operation.
  • Commercial temperature grade Rated for operation from 0 °C to 85 °C and labeled as Commercial grade for standard temperature applications.
  • Compact FCBGA package 1152‑BBGA / 1152‑FBGA (35 × 35 mm) surface‑mount package for dense board integration.
  • RoHS compliant Meets RoHS environmental requirements for lead‑free assembly and regulatory compliance.
  • Datasheet coverage Electrical and switching characteristics, including operating conditions and I/O timing, are documented in the Stratix V device datasheet.

Unique Advantages

  • High integration density: Large logic and memory counts reduce the need for multiple devices, simplifying system BOM and board complexity.
  • Generous I/O resources: 432 I/Os allow direct interfacing to many external components and wide parallel buses without additional I/O hardware.
  • Compact, manufacturable package: The 1152‑FBGA surface‑mount package supports dense PCB layouts while maintaining a standardized form factor.
  • Commercial readiness: Rated for 0 °C to 85 °C and specified as a commercial device for designs targeting standard temperature environments.
  • Regulatory friendliness: RoHS compliance streamlines environmental qualification for many markets and assemblies.

Why Choose 5SGXEA5K3F35C2L?

The 5SGXEA5K3F35C2L combines substantial programmable logic resources with significant embedded memory and a high I/O count in a compact FCBGA package, making it well suited for designers who need to consolidate complex logic and memory functions onto a single FPGA. Its commercial temperature rating and defined core voltage range make it straightforward to specify into standard commercial products.

Backed by Intel’s Stratix V device documentation for electrical and switching characteristics, this device offers a clear specification set for engineering validation, scalability for complex designs, and RoHS compliance for regulatory alignment.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and lead‑time details for the 5SGXEA5K3F35C2L.

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