5SGXEA5K3F35C2G

The 5SGXEA5K3F35C2G is a Stratix® V GX field‑programmable gate array (FPGA) from Intel designed for high‑density, I/O‑rich commercial applications. Built on the Stratix V GX family architecture, this device combines a large number of logic elements and substantial on‑chip RAM to support complex datapath, control, and buffering functions.

With approximately 490,000 logic elements, roughly 46.08 Mbits of embedded memory and 432 user I/Os in a 1152‑FBGA (35×35) surface‑mount package, the device targets system designs that require high integration, abundant local memory, and extensive interfacing in a commercial temperature range.

Key Features

• Core Capacity  Approximately 490,000 logic elements to implement large, complex logic designs and multi‑function systems.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM to support frame buffering, packet processing, and large state machines without depending solely on external memory.
• I/O Density  432 user I/Os to accommodate multi‑lane interfaces, broad sensor arrays, and dense board‑level connectivity.
• Package & Mounting  1152‑FBGA (35×35) surface‑mount package (1152‑BBGA, FCBGA case) for high‑pin‑count board designs that require compact, soldered integration.
• Power and Voltage  Core supply operating range of 870 mV to 930 mV to match regulated supply rails and power‑distribution designs.
• Temperature Grade  Commercial grade operation from 0 °C to 85 °C for standard commercial electronics environments.
• Regulatory  RoHS compliant for conformance with common environmental regulatory requirements.

Typical Applications

• High‑performance data processing  Implement large custom datapaths, hardware accelerators, and parallel processing pipelines using the device’s high logic and memory capacity.
• Telecommunications & networking  Support packet handling, protocol offload, and multiport interface logic where high I/O count and on‑chip buffering reduce external component needs.
• Test, measurement & instrumentation  Use wide I/O and abundant logic to aggregate signals, apply real‑time processing, and manage complex timing requirements.
• Embedded system integration  Consolidate multiple system functions—control, interface bridging, and data staging—onto a single FPGA to simplify BOM and PCB routing.

Unique Advantages

• High integration density: Large logic element count enables consolidation of multiple functions and subsystems into a single device, reducing board space and component count.
• Substantial on‑chip memory: Nearly 46.08 Mbits of embedded RAM provide local buffering and state storage, minimizing dependency on external memories for many designs.
• Extensive interfacing capability: 432 I/Os allow flexible, high‑pin‑count connectivity for multiport and multi‑lane applications without sacrificing signal availability.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for mainstream electronics and industrial‑adjacent commercial systems.
• Surface‑mount package for compact boards: 1152‑FBGA (35×35) package supports high‑density PCB layouts and modern assembly processes.
• RoHS compliance: Meets common environmental directives for lead‑free manufacturing requirements.

Why Choose 5SGXEA5K3F35C2G?

The 5SGXEA5K3F35C2G positions itself as a high‑capacity, I/O‑dense Stratix V GX FPGA suitable for commercial designs that demand significant programmable logic resources and on‑chip memory. Its combination of roughly 490,000 logic elements, approximately 46.08 Mbits of embedded RAM, and 432 user I/Os in a 1152‑FBGA package makes it well suited for complex data processing, interface aggregation, and system consolidation projects.

Backed by Intel’s Stratix V family documentation and support materials, this device offers designers a scalable platform for prototyping and deploying advanced FPGA‑based solutions where integration, memory depth, and I/O count drive design decisions.

Request a quote or submit an availability inquiry today to evaluate 5SGXEA5K3F35C2G for your next design.