5SGXEA5K3F35C2N

The 5SGXEA5K3F35C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in a 1152‑BBGA (35×35) package, offered in a commercial temperature grade. It provides a high-density programmable logic fabric and on-chip memory suitable for complex, transceiver-capable designs.

Designed for applications that require large logic capacity, substantial embedded RAM, and broad I/O, this device combines 490,000 logic elements with approximately 46 Mbits of embedded memory and 432 I/Os, while operating from a 0.87–0.93 V core supply in a surface-mount FCBGA package.

Key Features

• Core Logic  490,000 logic elements (cells) for high-density programmable logic implementation and complex system integration.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support large buffering, state storage, and local data processing.
• I/O Capability  432 user I/O pins to enable extensive peripheral interfacing and multi-protocol connectivity.
• Transceiver Family Capability  Part of the Stratix V GX family, which includes GX transceiver speed grades; consult the family datasheet for supported transceiver options and speeds.
• Power and Core Voltage  Core supply range of 870 mV to 930 mV to match low-voltage core domains and power budgeting requirements.
• Package and Mounting  1152‑FBGA (35×35) FCBGA package, surface-mount for compact board-level integration.
• Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental and supply-chain considerations.

Typical Applications

• High-speed serial and transceiver designs  Leverage the Stratix V GX family transceiver capabilities for serial link and protocol implementations (see family datasheet for grade-specific speeds).
• Complex digital signal processing  Large logic count and abundant on-chip RAM support compute-intensive DSP pipelines and custom data-path accelerators.
• Interface bridging and system integration  Rich I/O (432 pins) enables multiple protocol interfaces and board-level consolidation in communications and networking equipment.

Unique Advantages

• High logic density: 490,000 logic elements enable consolidation of large functions and multi-block designs on a single device, reducing external components.
• Substantial embedded memory: Approximately 46 Mbits of on-chip RAM minimizes external memory dependency for buffering and state storage.
• Broad I/O support: 432 I/Os provide flexibility for mixed-signal interfaces, parallel buses, and high-pin-count peripherals.
• Low-voltage core operation: 0.87–0.93 V core supply supports low-power core domains and modern power-rail architectures.
• Compact FCBGA package: 1152‑FBGA (35×35) surface-mount package delivers high integration density for space-constrained boards.
• RoHS compliant: Meets environmental directives to simplify supply-chain compliance.

Why Choose 5SGXEA5K3F35C2N?

The 5SGXEA5K3F35C2N positions itself as a high-density Stratix V GX FPGA option for designers who need significant programmable logic, ample embedded RAM, and extensive I/O in a compact FCBGA package. Its commercial-grade operating range and low core-voltage operation make it suitable for a wide range of board-level digital systems where density, embedded memory, and transceiver-capable family features are required.

For engineering teams tackling complex interfacing, signal processing, or transceiver-enabled designs, this device provides a balance of capacity and package-level integration that supports scalable designs and reduced bill-of-materials.

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