5SGXEA5K3F35C4G

The 5SGXEA5K3F35C4G is a Stratix® V GX field programmable gate array (FPGA) in a 1152-ball FCBGA package. It delivers a high-density programmable fabric with 490,000 logic elements and approximately 46.08 Mbits of embedded memory for designs that require substantial on-chip logic and RAM.

Designed for commercial-temperature applications, this device offers extensive I/O and a low-voltage core supply, making it suitable for systems that prioritize high integration, on-chip memory capacity, and large I/O connectivity within a surface-mount BGA footprint.

Key Features

• Core Logic — 490,000 logic elements for implementing large, complex digital designs and custom logic functions.
• Embedded Memory — Approximately 46.08 Mbits of on-chip RAM to support buffering, look-up tables, and memory-intensive functions without external memory dependencies.
• I/O Capacity — 432 I/O pins to connect multiple peripherals, parallel interfaces, and multi-channel front ends directly to the FPGA fabric.
• Power — Core voltage supply range of 820 mV to 880 mV to match platform power-rail specifications.
• Package & Mounting — 1152-ball FCBGA (1152-FBGA, 35×35) surface-mount package for compact board-level integration and high pin density.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Implement complex datapaths and large-scale state machines using the 490,000 logic elements and extensive embedded RAM.
• Multi-channel I/O systems — Support systems requiring many parallel interfaces or channelized front ends with 432 available I/Os.
• Integrated system controllers — Combine on-chip memory and logic to consolidate functions that would otherwise require multiple discrete components.

Unique Advantages

• High on-chip integration: 490,000 logic elements and ~46.08 Mbits of embedded memory reduce reliance on off-chip parts and simplify board-level design.
• Extensive I/O connectivity: 432 I/Os enable flexible interfacing with sensors, peripherals, and external devices without complex multiplexing.
• Compact, high-density package: 1152-ball FCBGA (35×35) provides a small footprint with high pin count for space-constrained PCBs.
• Low-voltage core support: 820–880 mV supply range aligns with modern low-voltage power domains to help manage overall system power architecture.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial applications and deployments.
• RoHS compliance: Meets RoHS requirements for environmental and regulatory consistency.

Why Choose 5SGXEA5K3F35C4G?

The 5SGXEA5K3F35C4G positions itself as a high-capacity Stratix V GX FPGA suitable for designs that require significant on-chip logic and memory in a compact BGA package. Its combination of 490,000 logic elements, approximately 46.08 Mbits of embedded RAM, and 432 I/Os enables consolidation of complex subsystems and streamlines board design for commercial applications.

This device is ideal for engineering teams building systems that need high integration density, substantial embedded memory, and broad I/O connectivity while operating within commercial temperature limits. Its RoHS compliance and surface-mount FCBGA package support modern manufacturing and assembly flows.

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