5SGXEA5K3F35C2LN

The 5SGXEA5K3F35C2LN is a Stratix V GX commercial-grade FPGA device that delivers very high logic density and substantial on-chip memory for demanding digital designs. As a member of the Stratix V GX family, this device targets applications that require large programmable logic capacity, significant embedded RAM, and a high count of general-purpose I/O.

Designed for surface-mount deployment, the device integrates approximately 490,000 logic elements and approximately 46.08 Mbits of embedded memory in a 1152-ball BGA package, supporting designs where dense integration and high I/O count are primary requirements.

Key Features

• Logic Capacity — Approximately 490,000 logic elements to implement large digital designs and complex custom logic.
• Embedded Memory — Approximately 46.08 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive processing tasks.
• I/O Density — 432 user I/Os to support broad peripheral interfacing and board-level connectivity.
• Package and Mounting — 1152-BBGA (FCBGA) / supplier package 1152-FBGA (35×35) in a surface-mount form factor for compact PCB integration.
• Core Voltage — Core supply voltage range 0.82 V to 0.88 V to match platform power rails and device requirements.
• Operating Temperature — Commercial temperature grade rated from 0 °C to 85 °C for standard commercial-environment deployments.
• Compliance — RoHS-compliant to meet common environmental regulatory requirements.
• Stratix V GX Family Characteristics — Part of the Stratix V GX series, which is documented with electrical and switching characteristics covering operating conditions, power consumption, I/O timing, and transceiver behavior.

Typical Applications

• High-density logic systems — Use the device where large amounts of programmable logic are needed to implement complex state machines, data-paths, or custom accelerators.
• Memory-intensive processing — Leverage approximately 46.08 Mbits of embedded RAM for buffering, packet handling, or intermediate data storage in processing pipelines.
• High I/O connectivity — Deploy in designs requiring many external interfaces or board-level signals using the device’s 432 I/Os.
• Board-level integration — Surface-mount 1152-FBGA package enables compact PCB layouts for space-constrained systems.

Unique Advantages

• High logic density: Approximately 490,000 logic elements allow consolidation of complex functions into a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 46.08 Mbits of on-chip RAM supports large buffers and memory-hungry logic without external memory in many use cases.
• Extensive I/O resources: 432 I/Os provide flexible interfacing options to sensors, processors, and high-pin-count peripherals.
• Commercial temperature rating: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• Compact package: 1152-ball FCBGA (35×35) facilitates dense PCB integration while supporting high pin count.
• Regulatory compliance: RoHS compliant to align with common environmental and manufacturing requirements.

Why Choose 5SGXEA5K3F35C2LN?

The 5SGXEA5K3F35C2LN pairs very high logic capacity with substantial embedded memory and a large I/O complement in a single commercial-grade Stratix V GX device. It is well suited to designs that demand dense programmable logic, significant on-chip RAM, and many external interfaces while fitting into a compact 1152-ball surface-mount package.

As part of the Stratix V GX family, this device is supported by documented electrical and switching characteristics covering operating conditions, power, I/O timing, and transceiver behavior, helping teams evaluate fit and performance for medium- to high-complexity commercial applications.

Request a quote or submit an inquiry to obtain pricing, availability, and delivery details for the 5SGXEA5K3F35C2LN. Technical and procurement teams can use the part number to expedite evaluation and sourcing.